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[공지사항]피닉스컨택트 공식 대리점

2018.07.30

[공지사항]피닉스컨택트 공식 대리점 new

AK정보통신 피닉스컨택트 공식 대리점 협약 완료지난 6월 에이케이정보통신(주)은 피닉스컨택트와 공식적인 업무 협약을 맺고 공식 대리점으로 업무를 시작하였습니다.고객 여러분의 많은 관심 부탁 드리며 자세한 사항은 하기 연락처로 문의 주시면 바로 답변 드리겠습니다.E-mail:sales@goak.co.kr전화번호:02-6093-8888

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On-Line ARTiGO-A1100

2013.08.09

On-Line ARTiGO-A1100

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On-Line AAEON(7)

2013.08.09

On-Line AAEON(7)

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On-Line AAEON(6)

2013.08.09

On-Line AAEON(6)

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On-Line AAEON(5)

2013.08.09

On-Line AAEON(5)

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On-Line AAEON(4)

2013.08.09

On-Line AAEON(4)

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On-Line AAEON(3)

2013.08.09

On-Line AAEON(3)

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On-Line AAEON(2)

2013.08.09

On-Line AAEON(2)

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On-Line AAEON(1)

2013.08.09

On-Line AAEON(1)

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On-Line InnoLite mSATA D150Q

2013.08.09

On-Line InnoLite mSATA D150Q

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On-Line 2.5 SATA SSD 3ME

2013.08.09

On-Line 2.5 SATA SSD 3ME

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[InnoDisk]Innodisk Releases World's First Industrial-Embedded SATA µSSD – nanoSSD

2013.05.28

[InnoDisk]Innodisk Releases World's First Industrial-Embedded SATA µSSD – nanoSSD

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[InnoDisk]Innodisk Releases DDR4 RDIMM Samples to Server Market

2013.05.28

[InnoDisk]Innodisk Releases DDR4 RDIMM Samples to Server Market

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[InnoDisk]The New SATA III Industrial Flash S-t-o-r-a-g-e Range from Innodisk Is Now Available

2013.05.28

[InnoDisk]The New SATA III Industrial Flash S-t-o-r-a-g-e Range from Innodisk Is Now Available

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[InnoDisk]Innodisk Talks iSLC & SATA III at DesignWest 2013

2013.05.28

[InnoDisk]Innodisk Talks iSLC & SATA III at DesignWest 2013

  Innovating Today’s Industrial Grade Storage for Tomorrow's Challenges April 11, 2013, Taipei, Taiwan – Innodisk, a leading designer and manufacturer of industrial flash and DRAM storage products, will be exhibiting at DesignWest in San Jose, CA fr|om April 22-25. Innodisk invites media, industrial partners and attendees wishing to further their technical knowledge to visit its booth, #1924 at the San Jose McEnery Convention Center.  Innodisk will have its newest products and designs that it has developed to meet the current challenges facing engineers with embedded applications, including: SATA III interface industrial flash devices and back-end designs that optimize MLC NAND Flash. SATA III is on the cutting-edge for the industrial market, as it is currently not prevalent for industrial applications. Innodisk's SATA III products offer superior speeds, while consuming about the same amount of power as SATA II products. This allows those with embedded designs to incorporate faster speeds without significant increases in power consumption.The full range of Innodisk products will be on display at the booth, including SATADOM, SSD, mSATA, CFast, SATA Slim and NGFF form factors. Additionally, Innodisk will be showcasing a live demonstration of its SATA III SATADOM, the world's smallest industrial storage form factor, running Innodisk's exclusive monitoring technology, iSMART. Also on display at the Innodisk booth will be products with the newly developed proprietary flash memory storage firmware, iSLC, which optimizes superior MLC NAND Flash to ensure longer lifespans and more reliable performance for SSDs. With this technology industrial users receive similar write speeds and data quality as SLC-based technologies at a more competitive price point.  A recently released white paper on iSLC is available for download, with a more in-depth look at the technology and how Innodisk uses it to revolutionize its SSDs for the industrial embedded marketplace.

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[VAI]VIA Announces Latest VIA Pico-ITX Board to Jump Start In-Vehicle Innovation, VIA VAB-600

2013.05.28

[VAI]VIA Announces Latest VIA Pico-ITX Board to Jump Start In-Vehicle Innovation, VIA VAB-600

Ultra low power design with optional 3G connectivity and battery power support ideal for a broad range of in-vehicle and mobile applications   Taipei, Taiwan, 30th April, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-600 Pico-ITX embedded board. Featuring an 800MHz ARM Cortex-A9 processor, the VIA VAB-600 combines a wide operating temperature range (0°C up to 60°C) with extremely low power consumption and optional 3G connectivity to fuel in-vehicle innovation as well as a broad range of mobile and healthcare applications. The VIA VAB-600 Pico-ITX board features a rich I/O set with superb multimedia performance, including a built-in Multi-standard decoder for playback support of the most demanding video formats in resolutions up to 1080p. Leveraging VIA’s hardware design expertise, the VIA VAB-600 includes a broad range of on-board pin-headers to provide optional 3G or WiFi connectivity, touch screen support and support for either battery or 12V~24V DC-in power options in an ultra-compact design. Customers can take advantage of VIA’s worldwide embedded software development expertise to quickly create customized designs for a fast time-to-market approach and is available as a hardware starter kit. Board support packages (BSPs) for either Android (4.0) or Embedded Linux (Kernel 3.0.8) operating systems are also available. “The VIA VAB-600 Pico-ITX allows our customers to jump start innovation for in-vehicle and mobile applications,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “By leveraging our starter kits and customization expertise, customers are provided with a flexible development path to quickly and easily bring new products to market.”   VIA VAB-600 Pico-ITX   Based on the ultra compact Pico-ITX form factor, measuring 10 cm x 7.2 cm, the VIA VAB-600 combines an 800MHz ARM Cortex-A9 processor with a built-in 2D/3D graphics engine, supporting OpenGL® ES 2.0, to deliver a smooth user experience and superb multimedia performance. Customers can leverage our starter kits which include a VIA VAB-600 Pico-ITX board, VAB-600-A I/O card, VAB-600-C TTL Converter card, 7” touch screen TTL panel, cables and 18W AC adaptor. Rear I/O includes one Mini HDMI port, two Mini-USB 2.0 ports, one 10/100 Ethernet port and 1 12~24V DC-in jack. On-board features include 4GB eMMC Flash memory, 1GB DDR3 SDRAM, one DVO connector for TTL or LVDS display, two COM ports, SPI, one USB 2.0 connector, one Mini Card slot (supports USB 2.0 connectivity for optional WiFi module VNT9271B6050), support for one SIM card slot, touch screen connector, front pin headers for line-in/out and MIC-in, I2C and GPIO pin header, and one battery charger connector with smart battery function.   For more information about the VIA VAB-600 Pico-ITX, please visit:http://www.viaembedded.com/en/products/boards/2070/1/VAB-600_(Pico-ITX).html   For more information about our VIA VAB-600 evaluation kits, please visit:http://www.viaembedded.com/en/downloads/EvaluationKit.jsp   For images related to this release, please visit:http://www.viagallery.com/Products/via-vab-600-pico-itx-board.aspx

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[VIA]VIA Announces Distribution Partnership with Italy\'s Top Electronics and Embedded Systems Distr

2013.05.28

[VIA]VIA Announces Distribution Partnership with Italy\'s Top Electronics and Embedded Systems Distr

VIA to showcase full range of products in the Jampel booth at Embedded IC & Automation Fortronic 2013   Taipei, Taiwan, 22 April, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced that it has signed a distribution agreement with Jampel, the top embedded distributor in Italy. The agreement gives Jampel the ability to promote, distribute, market and sell the full line of VIA Embedded products throughout Italy. VIA will be demoing a full range of products this April 23rd as part of the Jampel booth at Embedded IC & Automation Fortronic 2013, in the Centre Congressi Milanofiori, Milan. \"Jampel embedded customers are increasingly searching for low power, complete solutions in both x86 and ARM architectures to match the demands of the evolving market,” said Maurizio Di Banella, President of Jampel S.r.l.. “Our partnership with VIA technologies allows us to significantly widen our embedded product and solution offerings, guaranteeing our customers industry leading technology, reliability, quality and support.”   Headquartered in Bologna, Italy, Jampel is the leading distributor of passive electronic components and embedded systems across Italy. With over 20 years of experience, Jampel has been driving innovation in transportation and public administration infrastructure with their leading value-add system integration.   “VIA has always maintained very high standards when working with distributors. We are happy to say that Jampel easily meets these standards as a world-class embedded systems supplier,” said Epan Wu, Head of VIA Embedded, VIA Technologies, Inc. “With their dynamic approach, technical know-how and strong co-working model with vendors, Jampel is the ideal partner for extending our brand across the Italian market.”   For more information about Embedded IC & Automation Fortronic 2013, please visit:http://www.fortronic.it/page.asp?pag=1282&eveid=293&ln=2

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[VIA]VIA Come-8x80 (with custom carrier board) in GE healthercare

2013.05.14

[VIA]VIA Come-8x80 (with custom carrier board) in GE healthercare

VIA Come-8x80(with custom carrier board)으로미국 GE healthercare 마취 장비에 적용이 되었습니다.     하기 사이트에서 실물 확인이 가능합니다. http://www3.gehealthcare.co.uk/en-GB/Products/Categories/Anesthesia_Delivery/Avance_CS2_with_ecoFLOW   The VIA COMe-8X80 is a fanless*1 COM Expressform factor module that offers full 64-bit computing and high performance multimedia features suited for a variety of next-generation embedded applications. Available with a choice of 1.3GHz or 800MHz VIA Nano processors the VIA COMe-8X80 also integrates the unified VIA VX800 media system processor, replacing the traditional chipset with a unified single chip solution. The VIA VX800 incorporates VIA Chrome9 integrated graphics with support for VGA, and dual channel LVDS displays. Targeted at industrial PC and large OEM customers focused on dynamic application segments, including advanced gaming, industrial automation and digital signage, customers can take advantage of a proprietary multi-I/O baseboard, or can utilize VIA\'s extensive technical support in developing a custom baseboard. Measuring 95mm x 125 mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to provide greater connectivity and data transfer bandwidth than the original COM (Computer-on-Module) standard. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O baseboard.   VIA COMe-8X80 Product Highlights:   High performance VIA Nano processor 18/24-bit dual channel LVDS plus VGA Three PCI, and one x4 plus two x1 PCIe slots Up to 2GB of DDR2 10/100Mbps Fast Ethernet Up to six USB 2.0 ports Up to two SATA devices plus 1 IDE

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[InnoDisk]Innodisk Innovates on NA-ND Flash to create iSLC Flash Technology, More Reliable Than MLC

2013.04.03

[InnoDisk]Innodisk Innovates on NA-ND Flash to create iSLC Flash Technology, More Reliable Than MLC

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[InnoDisk]Innodisk to Showcase SATA III Industrial Flash Devices and MLC Optimizing Back-End Designs

2013.04.03

[InnoDisk]Innodisk to Showcase SATA III Industrial Flash Devices and MLC Optimizing Back-End Designs

Innodisk to Showcase SATA III Industrial Flash Devices and MLC Optimizing Back-End Designs at Storage Networking World Spring 2013   Taipei, Taiwan – March 28, 2013 - Innodisk, a designer and manufacturer of SSDs for industrial applications, will be exhibiting at Storage Networking World (SNW) Spring 2013 in Orlando, Florida fr|om April 2-4. Innodisk invites media, industrial partners and all other interested parties to booth, A3, at the Rosen Shingle Creek Hotel to see the new products and designs that Innodisk has developed to meet the current challenges of data centers designers and users of industrial storage face, including: SATA III interface industrial flash devices and back-end designs that optimize MLC NAND Flash. While SATA III is common in consumer circles, it is a new trend for the industrial market. Innodisk's SATA III products offer superior speeds, while consuming less power than SATA II products. This provides the storage networking community the ability to reap speed benefits without sacrificing their power consumption conservation efforts. The full range of Innodisk's products will be on display at the booth, including SSD, mSATA, CFast, SATA Slim and NGFF form factors. Additionally, Innodisk will have its SATA III SATADOM, the world's smallest industrial storage form factor, at SNW Spring 2013. Innodisk will also be displaying products with its newly developed proprietary flash mem Visitors to Innodisk's booth will also be able to learn more about iSMART, a powerful monitoring tool that allows system integrators to track important disk information, such as temperature, storage space, bad blocks, and lifespan of the drive. With the ability to anticpate the end of the disk's life cycle, system integrators can transfer their valuable data and replace the disk drive. Innodisk invites all to visit booth A3 at SNW Spring 2013 to see and learn about the new technologies the company is implementing in the storage networking community.

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[InnoDisk]Innodisk Leads the Way in New Trends for Industrial Flash Memory in 2013

2013.04.03

[InnoDisk]Innodisk Leads the Way in New Trends for Industrial Flash Memory in 2013

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