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[공지사항]피닉스컨택트 공식 대리점

2018.07.30

[공지사항]피닉스컨택트 공식 대리점 new

AK정보통신 피닉스컨택트 공식 대리점 협약 완료지난 6월 에이케이정보통신(주)은 피닉스컨택트와 공식적인 업무 협약을 맺고 공식 대리점으로 업무를 시작하였습니다.고객 여러분의 많은 관심 부탁 드리며 자세한 사항은 하기 연락처로 문의 주시면 바로 답변 드리겠습니다.E-mail:sales@goak.co.kr전화번호:02-6093-8888

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On-Line AAEON(7)

2013.08.09

On-Line AAEON(7)

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On-Line AAEON(6)

2013.08.09

On-Line AAEON(6)

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On-Line AAEON(5)

2013.08.09

On-Line AAEON(5)

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On-Line AAEON(4)

2013.08.09

On-Line AAEON(4)

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On-Line AAEON(3)

2013.08.09

On-Line AAEON(3)

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On-Line AAEON(2)

2013.08.09

On-Line AAEON(2)

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On-Line AAEON(1)

2013.08.09

On-Line AAEON(1)

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On-Line InnoLite mSATA D150Q

2013.08.09

On-Line InnoLite mSATA D150Q

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On-Line 2.5 SATA SSD 3ME

2013.08.09

On-Line 2.5 SATA SSD 3ME

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[InnoDisk]Innodisk Releases World's First Industrial-Embedded SATA µSSD – nanoSSD

2013.05.28

[InnoDisk]Innodisk Releases World's First Industrial-Embedded SATA µSSD – nanoSSD

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[InnoDisk]Innodisk Releases DDR4 RDIMM Samples to Server Market

2013.05.28

[InnoDisk]Innodisk Releases DDR4 RDIMM Samples to Server Market

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[InnoDisk]The New SATA III Industrial Flash S-t-o-r-a-g-e Range from Innodisk Is Now Available

2013.05.28

[InnoDisk]The New SATA III Industrial Flash S-t-o-r-a-g-e Range from Innodisk Is Now Available

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[InnoDisk]Innodisk Talks iSLC & SATA III at DesignWest 2013

2013.05.28

[InnoDisk]Innodisk Talks iSLC & SATA III at DesignWest 2013

  Innovating Today’s Industrial Grade Storage for Tomorrow's Challenges April 11, 2013, Taipei, Taiwan – Innodisk, a leading designer and manufacturer of industrial flash and DRAM storage products, will be exhibiting at DesignWest in San Jose, CA fr|om April 22-25. Innodisk invites media, industrial partners and attendees wishing to further their technical knowledge to visit its booth, #1924 at the San Jose McEnery Convention Center.  Innodisk will have its newest products and designs that it has developed to meet the current challenges facing engineers with embedded applications, including: SATA III interface industrial flash devices and back-end designs that optimize MLC NAND Flash. SATA III is on the cutting-edge for the industrial market, as it is currently not prevalent for industrial applications. Innodisk's SATA III products offer superior speeds, while consuming about the same amount of power as SATA II products. This allows those with embedded designs to incorporate faster speeds without significant increases in power consumption.The full range of Innodisk products will be on display at the booth, including SATADOM, SSD, mSATA, CFast, SATA Slim and NGFF form factors. Additionally, Innodisk will be showcasing a live demonstration of its SATA III SATADOM, the world's smallest industrial storage form factor, running Innodisk's exclusive monitoring technology, iSMART. Also on display at the Innodisk booth will be products with the newly developed proprietary flash memory storage firmware, iSLC, which optimizes superior MLC NAND Flash to ensure longer lifespans and more reliable performance for SSDs. With this technology industrial users receive similar write speeds and data quality as SLC-based technologies at a more competitive price point.  A recently released white paper on iSLC is available for download, with a more in-depth look at the technology and how Innodisk uses it to revolutionize its SSDs for the industrial embedded marketplace.

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[VAI]VIA Announces Latest VIA Pico-ITX Board to Jump Start In-Vehicle Innovation, VIA VAB-600

2013.05.28

[VAI]VIA Announces Latest VIA Pico-ITX Board to Jump Start In-Vehicle Innovation, VIA VAB-600

Ultra low power design with optional 3G connectivity and battery power support ideal for a broad range of in-vehicle and mobile applications   Taipei, Taiwan, 30th April, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-600 Pico-ITX embedded board. Featuring an 800MHz ARM Cortex-A9 processor, the VIA VAB-600 combines a wide operating temperature range (0°C up to 60°C) with extremely low power consumption and optional 3G connectivity to fuel in-vehicle innovation as well as a broad range of mobile and healthcare applications. The VIA VAB-600 Pico-ITX board features a rich I/O set with superb multimedia performance, including a built-in Multi-standard decoder for playback support of the most demanding video formats in resolutions up to 1080p. Leveraging VIA’s hardware design expertise, the VIA VAB-600 includes a broad range of on-board pin-headers to provide optional 3G or WiFi connectivity, touch screen support and support for either battery or 12V~24V DC-in power options in an ultra-compact design. Customers can take advantage of VIA’s worldwide embedded software development expertise to quickly create customized designs for a fast time-to-market approach and is available as a hardware starter kit. Board support packages (BSPs) for either Android (4.0) or Embedded Linux (Kernel 3.0.8) operating systems are also available. “The VIA VAB-600 Pico-ITX allows our customers to jump start innovation for in-vehicle and mobile applications,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “By leveraging our starter kits and customization expertise, customers are provided with a flexible development path to quickly and easily bring new products to market.”   VIA VAB-600 Pico-ITX   Based on the ultra compact Pico-ITX form factor, measuring 10 cm x 7.2 cm, the VIA VAB-600 combines an 800MHz ARM Cortex-A9 processor with a built-in 2D/3D graphics engine, supporting OpenGL® ES 2.0, to deliver a smooth user experience and superb multimedia performance. Customers can leverage our starter kits which include a VIA VAB-600 Pico-ITX board, VAB-600-A I/O card, VAB-600-C TTL Converter card, 7” touch screen TTL panel, cables and 18W AC adaptor. Rear I/O includes one Mini HDMI port, two Mini-USB 2.0 ports, one 10/100 Ethernet port and 1 12~24V DC-in jack. On-board features include 4GB eMMC Flash memory, 1GB DDR3 SDRAM, one DVO connector for TTL or LVDS display, two COM ports, SPI, one USB 2.0 connector, one Mini Card slot (supports USB 2.0 connectivity for optional WiFi module VNT9271B6050), support for one SIM card slot, touch screen connector, front pin headers for line-in/out and MIC-in, I2C and GPIO pin header, and one battery charger connector with smart battery function.   For more information about the VIA VAB-600 Pico-ITX, please visit:http://www.viaembedded.com/en/products/boards/2070/1/VAB-600_(Pico-ITX).html   For more information about our VIA VAB-600 evaluation kits, please visit:http://www.viaembedded.com/en/downloads/EvaluationKit.jsp   For images related to this release, please visit:http://www.viagallery.com/Products/via-vab-600-pico-itx-board.aspx

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[VIA]VIA Announces Distribution Partnership with Italy\'s Top Electronics and Embedded Systems Distr

2013.05.28

[VIA]VIA Announces Distribution Partnership with Italy\'s Top Electronics and Embedded Systems Distr

VIA to showcase full range of products in the Jampel booth at Embedded IC & Automation Fortronic 2013   Taipei, Taiwan, 22 April, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced that it has signed a distribution agreement with Jampel, the top embedded distributor in Italy. The agreement gives Jampel the ability to promote, distribute, market and sell the full line of VIA Embedded products throughout Italy. VIA will be demoing a full range of products this April 23rd as part of the Jampel booth at Embedded IC & Automation Fortronic 2013, in the Centre Congressi Milanofiori, Milan. \"Jampel embedded customers are increasingly searching for low power, complete solutions in both x86 and ARM architectures to match the demands of the evolving market,” said Maurizio Di Banella, President of Jampel S.r.l.. “Our partnership with VIA technologies allows us to significantly widen our embedded product and solution offerings, guaranteeing our customers industry leading technology, reliability, quality and support.”   Headquartered in Bologna, Italy, Jampel is the leading distributor of passive electronic components and embedded systems across Italy. With over 20 years of experience, Jampel has been driving innovation in transportation and public administration infrastructure with their leading value-add system integration.   “VIA has always maintained very high standards when working with distributors. We are happy to say that Jampel easily meets these standards as a world-class embedded systems supplier,” said Epan Wu, Head of VIA Embedded, VIA Technologies, Inc. “With their dynamic approach, technical know-how and strong co-working model with vendors, Jampel is the ideal partner for extending our brand across the Italian market.”   For more information about Embedded IC & Automation Fortronic 2013, please visit:http://www.fortronic.it/page.asp?pag=1282&eveid=293&ln=2

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[VIA]VIA Come-8x80 (with custom carrier board) in GE healthercare

2013.05.14

[VIA]VIA Come-8x80 (with custom carrier board) in GE healthercare

VIA Come-8x80(with custom carrier board)으로미국 GE healthercare 마취 장비에 적용이 되었습니다.     하기 사이트에서 실물 확인이 가능합니다. http://www3.gehealthcare.co.uk/en-GB/Products/Categories/Anesthesia_Delivery/Avance_CS2_with_ecoFLOW   The VIA COMe-8X80 is a fanless*1 COM Expressform factor module that offers full 64-bit computing and high performance multimedia features suited for a variety of next-generation embedded applications. Available with a choice of 1.3GHz or 800MHz VIA Nano processors the VIA COMe-8X80 also integrates the unified VIA VX800 media system processor, replacing the traditional chipset with a unified single chip solution. The VIA VX800 incorporates VIA Chrome9 integrated graphics with support for VGA, and dual channel LVDS displays. Targeted at industrial PC and large OEM customers focused on dynamic application segments, including advanced gaming, industrial automation and digital signage, customers can take advantage of a proprietary multi-I/O baseboard, or can utilize VIA\'s extensive technical support in developing a custom baseboard. Measuring 95mm x 125 mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to provide greater connectivity and data transfer bandwidth than the original COM (Computer-on-Module) standard. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O baseboard.   VIA COMe-8X80 Product Highlights:   High performance VIA Nano processor 18/24-bit dual channel LVDS plus VGA Three PCI, and one x4 plus two x1 PCIe slots Up to 2GB of DDR2 10/100Mbps Fast Ethernet Up to six USB 2.0 ports Up to two SATA devices plus 1 IDE

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[InnoDisk]Innodisk Innovates on NA-ND Flash to create iSLC Flash Technology, More Reliable Than MLC

2013.04.03

[InnoDisk]Innodisk Innovates on NA-ND Flash to create iSLC Flash Technology, More Reliable Than MLC

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[InnoDisk]Innodisk to Showcase SATA III Industrial Flash Devices and MLC Optimizing Back-End Designs

2013.04.03

[InnoDisk]Innodisk to Showcase SATA III Industrial Flash Devices and MLC Optimizing Back-End Designs

Innodisk to Showcase SATA III Industrial Flash Devices and MLC Optimizing Back-End Designs at Storage Networking World Spring 2013   Taipei, Taiwan – March 28, 2013 - Innodisk, a designer and manufacturer of SSDs for industrial applications, will be exhibiting at Storage Networking World (SNW) Spring 2013 in Orlando, Florida fr|om April 2-4. Innodisk invites media, industrial partners and all other interested parties to booth, A3, at the Rosen Shingle Creek Hotel to see the new products and designs that Innodisk has developed to meet the current challenges of data centers designers and users of industrial storage face, including: SATA III interface industrial flash devices and back-end designs that optimize MLC NAND Flash. While SATA III is common in consumer circles, it is a new trend for the industrial market. Innodisk's SATA III products offer superior speeds, while consuming less power than SATA II products. This provides the storage networking community the ability to reap speed benefits without sacrificing their power consumption conservation efforts. The full range of Innodisk's products will be on display at the booth, including SSD, mSATA, CFast, SATA Slim and NGFF form factors. Additionally, Innodisk will have its SATA III SATADOM, the world's smallest industrial storage form factor, at SNW Spring 2013. Innodisk will also be displaying products with its newly developed proprietary flash mem Visitors to Innodisk's booth will also be able to learn more about iSMART, a powerful monitoring tool that allows system integrators to track important disk information, such as temperature, storage space, bad blocks, and lifespan of the drive. With the ability to anticpate the end of the disk's life cycle, system integrators can transfer their valuable data and replace the disk drive. Innodisk invites all to visit booth A3 at SNW Spring 2013 to see and learn about the new technologies the company is implementing in the storage networking community.

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[InnoDisk]Innodisk Leads the Way in New Trends for Industrial Flash Memory in 2013

2013.04.03

[InnoDisk]Innodisk Leads the Way in New Trends for Industrial Flash Memory in 2013

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[InnoDisk]Innodisk Initiates New Trends for 2013 in Industrial Flash Memory

2013.04.03

[InnoDisk]Innodisk Initiates New Trends for 2013 in Industrial Flash Memory

Innodisk Initiates New Trends for 2013 in Industrial Flash Memory   The year 2012 was a big year for solid state drives (SSDs), which remained a bright spot in the storage world. According to a report released by information and analytics provider IHS iSuppli, unit shipments of SSDs throughout the year 2012 increased 1.29-fold fr|om 2011. However, in the industrial control segment, the fantastic growth of SSDs is accompanied with dramatic changes. Facing up to the changes in the marketplace, Innodisk, a major SSD provider for industrial applications, has prepared many technical innovations which have gathered great momentum to release in the year 2013.   Adoption of Multi-Level Cell (MLC) Flash memory has grown at a pace faster than expected. Yet, MLC flash has inherent limitations as a result of manufacturing yield issues, which need to be remedied by back-end designs of SSD devices. Innodisk has prepared solutions to solve these problems and further explored the potential of MLC Flash.   Secondly, SATAIII, which nearly doubles the read/write speeds of SATAII, has already become a mainstream data connection interface for consumer-grade products, and is currently emerging in the industrial application segment.  We believe that SATAIII will definitely become mainstream for industrial SSDs in the future as well. During the past half year, Innodisk has taken an aggressive pace and allocated more R&D resources to develop SATAIII SSDs. The company introduced its first 2.5” SATAIII SSD product line in the first quarter of this year, and will release miniaturized SATADOM and mSATA products also based on SATAIII later this year.   On the other hand, the trend of miniaturization continues. With the assistance of the Next Generation Form Factor standard stipulated by Intel (Intel NGFF), which helps to multiply the read/write speeds of smaller mSATA products, some key players in the market have been encouraged to adopt miniaturization. Miniaturization will definitely become unstoppable in 2013. Innodisk, which has already gained a market foothold in producing miniaturized modules, with its most important product line called SATADOM based on patented Pin 7 technology, will also introduce miniaturized products based on NGFF specification later this year.     Trend 1: Backend designs will determine the overall performance of Flash memory   The growth in popularity of SSDs and their ever increasing applications have resulted correspondingly in aggressive improvements in the Flash memory manufacturing process, making Flash memory much cheaper than ever. In the past, the industrial control segment preferred Single Level Cell (SLC) Flash memory due to its high reliability. However,  MLC Flash is now gaining an edge with much more competitive pricing. Many light industrial applications now opt for MLC memory, which has resulted in the quick rise of MLC in the industrial market.   Though having an advantage in pricing, MLC Flash is facing many challenges when it comes to adoption among the industrial segment. Most of these challenges originate fr|om the innate limitations of MLC, and the most fatal ones are its inferior reliability and endurance. Because MLC Flash memory requires more constrained voltage ranges, it is more susceptible to Error Correction Code (ECC) errors than SLC Flash memory and needs more ECC corrections to ensure accurate data storage. Therefore, MLC Flash memory is less reliable than SLC and has a shorter data retention lifetime.   More notable but often neglected is the fact that, with the production process scaling of Flash memory (to increase yield and reduce cost), MLC is facing quality degradation. When the process is scaled down fr|om 3X nm to 2X nm, the Programming/Erase Cycle (P/E Cycle) of MLC Flash memory drops for 60% fr|om ~5k to ~3k. The process scaling has also resulted in the need for more ECC bits: 2X nm MLC Flash requires 24 ECC bits, while 1X nm process requires 40 ECC bits—almost double.   When an increasing number of industrial customers prefer quality-degrading MLC Flash devices over SLC out of cost concerns, design of the backend module house becomes important in remedying the disadvantages of MLC. Innodisk has developed a series of leading technologies to solve the innate disadvantages of MLC Flash, such as using thermal sensors to aid in remedying MLC flash’s vulnerability to temperatures outside of its normal operating range. When a sensor detects the temperature dropping past a certain threshold, a thermal pad will start to heat up in order to maintain normal operating temperatures and ensure the reliability of the Flash memory and the device.   Innodisk excels at using firmware and hardware design to optimize endurance and reliability of original manufacturers’ products. One example is the iSLC technology-based SSDs it introduced in the final quarter of last year, which greatly enhanced the performance, reliability and endurance of MLC Flash through firmware design.   According to the technical aspects of Flash memory, each MLC Flash cell can store 2 bits of information, representing 4 distinct states: 00,01,10,11; while SLC Flash stores 1 bit value per cell, which can be interpreted as 2 distinct states: 0,1. Innodisk’s self-developed iSLC technology adjusts MLC-based Flash firmware to allow each MLC Flash cell to represent only 2 states, “0”or “1”, similar to that of SLC Flash.   Cc Wu, director of Embedded Flash Div., says, “We have the outstanding ability for choosing the best MLC Flash memory, and we know how to use our proprietary firmware technologies to allow our iSLC products to perform at almost the same level as SLC-based products with reliability and service lifetime similar to SLC-based products, all while maintaining a lower price.”   On the other hand, a good storage device monitoring tool is also very important. Innodisk’s newly revised iSMART 3.0 can monitor all storage devices in a system, allowing users to check read/write speeds and remaining life span of each storage device. This monitoring tool can also display storage device operation status and alert users of the remaining service lifetimes so that they can replace a disk in time. The latest iSMART version can also visualize SSD Wear-Leveling status with graphics.   Trend 2: SATAIII adoption is to rise in industrial control applications in 2013   SATA III (6.0 Gb/s) is a data connection interface standard stipulated by Serial ATA Working Group in 2009 allowing for backward compatibility with SATA II and SATA I, which is already a main implementation for consumer products. However, in the area of industrial control, where reliability is a priority, SATA II is still the norm.   However, as the SATA III specification is implemented for years in the consumer market, relevant technologies are getting quite mature. Considering its theoretical 600 MB/s high data transfer speed, we believe that SATAIII has become suitable for industrial applications.   Innodisk tested SATA III SSD performance on a SATA II platform, and found two-fold increase in read/write speeds of storage devices. Innodisk has spent half a year on developing SATA III devices, including finding ways to implement slumber and sleep modes for power-efficiency purposes. Innodisk is slated to introduce its SATA III product lines in the first half of this year, including SSD, SATADOM, mSATA, CFast, SATA Slim and NGFF.   Trend 3: Miniaturized devices will become mainstream   The miniaturization trend has been happening not only in the consumer market but also in the industrial control market as well. It is expected to become the norm in the industrial sector in this coming year.   Currently, industrial control applications ask for more space-saving host board designs, especially when an increasing number of mobile devices opt for smaller form factor designs that further constrain the space of host boards. Miniaturization is a trend that has been happening for years, with mSATA being the mainstream specification for miniaturized devices in the past. However, mSATA is not a good option for mass storage due to the constrained amount of Flash memory that can be deployed on a printed circuit board (PCB).   Yet, the Next Generation Form Factor (NGFF) stipulated by Intel including the SSD slot standard will be able to ease space constraints and enable a dramatic increase in data transfer speeds, which will be helpful in developing more storage devices of 2GB-16GB capacities—currently the mainstream requirements in industrial control. Intel NGFF has already been recognized and implemented by a number of major memory manufacturers, and Innodisk, a leader in miniaturized products renowned for its SATADOM series, will follow this new standard and introduce NGFF-based products in the second half of the year.   Innodisk utilizes its own technological know-how to develop world-leading data storage devices and memory modules which meet the strict requirements of mission-critical applications in aerospace, national defense, factories and embedded systems, with unique functionalities, forms and firmware designs. Our hardware, software and firmware specialists are ready to team up at any time to provide custom-tailored solutions that best meet our customers’ needs.

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