These cutting edge 1U network appliances offer expansive flexibility in most powerful processing configurations and customization services.   2014-02-19 (Taipei, Taiwan) February 19, 2014 — AAEON, a major developer of industrial computing solutions, today announces the FWS-7810 and FWS-7400 1U network appliances featuring support of 4th generation Intel® Core™ processors at varying clock speeds in dual & quad core designs. Cooled by two rear mounted fans, the FWS-7400 comes configured with six Gigabit Ethernet ports with an option for two pairs LAN bypass. With three rear mounted fans, the FWS-7810 is equipped with eight Gigabit Ethernet ports. For greater flexibility, the FWS-7400 features one Network Interface Module (NIM) expansion slot to support additional GbE or Fiber Optical connections and up to 16GB of DDR3 1600 MHz of system memory is supported. The FWS-7810 can support up to 32GB of DDR3 1600 MHz of system memory and PCIe expansion slots. In keeping with the st “For IT professionals in government, aerospace, education and retail markets, AAEON’s FWS-7400 and FWS-7810 offer outstanding performance and security features with rich connectivity options. This makes them strong contenders for any network administrator looking for some of the most advanced and cost effective features in a rackmount chassis available today.” said AAEON’s CTO, Wayne Chen. AAEON’s sophisticated network computing platforms such as the FWS-7400 and FWS-7810 offering robust firewall protection against data center breaches fr|om viruses, malware and other potential intrusions by offering a range of integrated and add-on security features such as Access Control, Anti-Virus, Anti-Spam, UTM, WAN optimization, VPN, IDS, IPS, and bandwidth management. These rackmount network appliances also include a programmable watchdog timer and Internal Real Time Clock to round out the features of these competitively designed systems. For more product and service information, please contact AAEON’s regional sales representatives or visit www.aaeon.com.  

  With its rugged design, the AEC-6977 is able to operate without airflow at -20° ~ 65°C to meet the most demanding requirements   2014-02-18     (Taipei, Taiwan) February 18, 2014 — AAEON, a major developer of industrial computing solutions, today announces the AEC-6977 fanless embedded computer, powered by the Intel® Core™ i7/ i5/ i3/ Celeron® processor and Intel® QM77 chipset, providing the best of both performance and rich I/O interface support. The AEC-6977 is able to operate without airflow at -20° ~ 65°C with Intel® Core™ i7-3517UE processor and is designed with a cable-free board to external connectivity for reliable signal transfers and better anti-vibration, with static protected isolation and two expansion slots for PCI or PCI-E add-on cards. This makes the AEC-6977 suitable for performance demanding applications for harsh environments such as automobile, factory automation, energy, power plants, warehouse and steel automation.     The AEC-6977 comes with two DDR3 1066/1333 MHz SODIMM slots to support a maximum of 16GB memory. Two Full HD independent displays are supported, with display options fr|om VGA, DVI, HDMI, and dual-channel 24-bit LVDS. Featuring two SATA 6.0Gb/s and two SATA 3.0Gb/s, supporting RAID 0, 1, 5, 10, together with a CFast™ slot for storage, four USB 3.0 and two USB2.0 ports, two Gigabit LAN ports, two RS-232 ports on the rear and two serial ports (expandable to six) in the front with optional 2.5KV isolation. In addition, 8-bit programmable digital I/O with optional 2.5KV isolation protection, wide DC-in of 9~30V input for power supply together with voltage protection makes the AEC-6977 suitable for operations in extreme environments with unstable power supply. As for expansion, the AEC-6977 provides ample options that include up to two PCIe x 4 or two PCI, two Mini Card slots and one SIM card slot (Optional).     “The AEC-6977 is a standalone high performance embedded controller which is designed for rugged environments due to the recent growing needs of today’s IPC market. With its extraordinary anti-vibration hard drive device option, the AEC-6977 can be used in high vibration environments,” stated Wayne Chen, CTO of AAEON. “Except for AEC-6977’s long-life operation capability and high reliability, it also offers low power consumption system while operating in ambient temperatures ranging fr|om -20° to 65°C with an Intel® Core™ i7-3517UE processor.”     For more product and service information, please contact AAEON’s regional sales representatives or visit www.aaeon.com.  

With a stylish aluminum design, the ACP-1073 brings a new evlolution of art concept into industrial applications. 2014-02-11     (Taipei, Taiwan) February 13, 2014 — AAEON, a major developer of industrial computing solutions, today announces the ultra-slim 7" ACP-1073 fanless multi-touch industrial panel computers with Intel® AtomTM N2600 processors for retail, agriculture, smart building, industry automation and environmental monitoring.     The ACP-1073 is a 7” fanless projected capacitive multi-touch HMI Touch Panel Computer and supports up to 2GB of DDR3 SODIMM memory, one Gigabit Ethernet, one internal WiFi module and one half size mSATA SSD for data storage. In addition, the ACP-1073 features four USB2.0 ports, one RS-232 and two RS-232/422/485 ports with RJ-45 connectors and one Mini HDMI port for interface convenience in applications such as industrial automation and infotainment. With resolution of 1024 x 600 and a responsive projected capacitive touch display, the ACP-1073 offers vivid display and ease of operation.     The ACP-1073 also features waterproof and 7H scratchproof glass covered borders, allowing panel installation to match the height of the surrounding walls simply by adjusting the panel mount brackets for different wall depths. With a sleek, easy-to-clean aesthetic design that supports full-flat surfacing for IP65 dust/waterproof, while offering high luminance of 250 cd/m2 and 12V DC input, the ACP-1073 is ideal for non-protruding or sink-in display requirements in industrial automation, factory automation, environmental monitoring, machine monitoring, smart building, home automation and retail applications.     “With width of only 30mm allowing for ease of installation in space constrained locations, the ACP-1073 hits the market with unique and outstanding aesthetic appeal including a revolutionary IP 65 water proof front bezel design”, states Wayne Chen, CTO of AAEON. “Although slim and compact in size, the ACP-1073 offers industrial grade strength and features with all of the commercial aesthetic requirements of modern day display installations.”     For more product and service information, please contact AAEON’s regional sales representatives or visit www.aaeon.com.  

VIA, Embedded World 2014에서 VIA VAB-1000 출시로 그래픽 집약적인 임베디드 안드로이드 디바이스 개발의 새장을 열다.업계를 선도하는 안드로이드 개발을 지원하는 고성능 그래픽과 비디오 엔진의 결합 2014년 2월 24일 - 뛰어난 전력 효율성의 ARM과 x86 컴퓨팅, 임베디드 플랫폼 선두기업 VIA Technologies, Inc,는 Embedded World 2014에서 신제품 VIA VAB-1000 Pico-ITX 보드를 선보였다. 2월 25일부터 27일까지 독일 뉘렌베르크(Nuremberg)에서 열리는 이번 전시회의 VIA 부스는 전시장 중앙의 Hall 5,5-330 이다. 1.0GHz 듀얼 코어 VIA Elite E1000 Cortex-A9 SoC가 탑재된 VIA VAB-1000은 고성능 그래픽과 다양한 멀티미디어 기능을 제공하는 비디오 엔진을 특징으로 키오스크, 디지털사이너지, HMI(휴먼 머신 인터페이스)와 같은 사용자 중심의 어플리케이션에 이상적인 솔루션이다. 임베디드 어플리케이션에서 안드로이드 기능을 활용하기 위해서 VIA는 SMART ETK (Embedded Tool Kit)와 소프트웨어 고객화 서비스를 제공하여 제품 개발 시간과 비용을 줄일 수 있도록 도와준다.   “안드로이드 스마트폰과 타블렛 시장의 성장으로 혁신적인 신산업을 창조할 수 있는 플랫폼과 쉬운 인터페이스와 고급형 기능이 있는 터치 베이스의 인터렉티브 멀티미디어 디바이스에 개발자들의 관심이 높아지고 있는 걸 확인할 수 있습니다. VAB -1000 의 출시로 VIA는 다양한 개발 툴 키트와 고객화 서비스와 함께 안드로이드 시스템 개발을 위한 풍부한 ARM 플랫폼 포트폴리오를 갖게 되었습니다.”라고 VIA 임베디드 플랫폼사업부 사업부장, Epan Wu가 인터뷰했다.   VIA VAB-1000 Pico-ITX VIA VAB-1000은 10 cm x 7.2 cm 사이즈의 울트라컴팩트Pico-ITX 폼팩터로 1.0GHz VIA Elite Cortex-A9 듀얼 코어 프로세서와 64 스트림 프로세서를 특징으로 하는 통합 쉐이드 아키텍쳐로 듀얼 독립 디스플레이를 지원하며 3D/2D 그래픽 엑셀레이션과 최대 1080p 해상도 에서 가장 요구하는 비디오 포맷의 Full HD 재생을 지원한다.   후면 패널 I/O 는 HDMI-in과 HDMI-out를 위한 2개의 HDMI 커넥터, 미니 USB 2.0 포트 1 개, 마이크로 SD 슬롯, 기가비트 이더넷 포트 및 DC-in 잭이 있다. 전면 패널 I/O 에는 두 개의 추가 USB 포트를 위한 핀 헤더, SPI 및 8-pin GPIO를 위한 핀 헤더, 세 개의 I2C 와 두 개의 COM 포트를 위한 핀 헤더, 전면 오디오 (Line-in/Line-Out/Mic-In)를 위한 핀 헤더를 제공한다. 다른 온보드 기능에는 4GB EMMC 플래시 메모리, 2GB DDR3 SDRAM, 하나의 듀얼 채널 LVDS 커넥터, 하나의 S-video 핀헤더, Mini-PCIe 핀헤더가 있다. VIA VAB-1000 에 대한 보다 자세한 정보는 다음 링크를 참고하세요.http://www.viaembedded.kr/kr/products/boards/2190/1/VAB-1000_(Pico-ITX).html   관련 이미지는 다음 링크를 참고하세요.http://www.viagallery.com/Products/via-vab-1000-pico-itx-board.aspx   VIA VAB-1000 I/O 확장 카드 VIA VAB-1000 I/O 확장 카드를 옵션으로 구성할 수 있다. 멀티 I/O 인터페이스에는 Line-In, Line-Out, Mic-In 오디오잭, 2개의 USB 포트, 일시중단 LED 파워 표시, 파워 온/오프 버튼, COM 포트 (TX/RX 지원)를 위한 핀헤더, 3개의 board-to-board 커넥터, USB board-to-board 커넥터 인터페이스가 포함되어있다.VIA VAB-1000안드로이드 Smart ETK The VIA VAB-1000 안드로이드 Smart ETK는 안드로이드 버전 4.1뿐만 아니라 Smart ETK로 시스템 보호를 위한 Watchdog Timer (WDT), GPIO 액세스, COM 포트 액세스, 오토-파워를 위한 RTC, 샘플App 등의 다양한 API를 구성할 수 있다.구매VIA VAB-1000 샘플 보드 구매 가능

August 2013     Innodisk Unveils Its Advanced Data Logging Technolody in Flash Memory Summit 2013 August 1, 2013 –Taipei, Taiwan Innodisk invites current and future partners to visit Booth #724–726 to learn more about Innodisk’s commitment to providing innovative and customized storage solutions. Immediately following this event, Innodisk will join exhibitors at ESC(Embedded System Conference) Brazil ’13 in Sao Paulo, fr|om August 27 to 28, at Booth #611. ...more Innodisk: SATA III Now Available For Aerospace and Defense Applications July 23, 2013 – Taipei, Taiwan Innodisk builds upon the Taiwan Top Excellence award winning SATA II based InnoRobust II SSD and brings SATA III speeds to a wide variety of rugged storage products in various form factors, including: 2.5-inch SSD, 1.8-inch SSD, SATA Slim and mSATA . These latest-generation products are speedy, rugged, with military grade data security, ...more Innodisk Long-Lifespan MLC SSDs Help POS Makers Avoid Storage Headaches, and Are More Cost Efficient June 27, 2013 – Taipei, Taiwan POS Makers Like AdvanPOS Are Adopting SSDs to Boost Performance and Reliability, and Reduce Long-Term Operating Costs. Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, is seeing huge interest in its new storage products fr|om the point of sale (POS) and retail industry. ...more   Products- nanoSSD, SATAIII SSD for Aerospace and Defense nanoSSD 3SEsee details nanoSSD 3MEsee details 2.5” SATA SSD 3SR-Psee details 2.5” SATA SSD 3MR-Psee details   Innodisk Trade Show Schedule Aug-Sep, 2013 Event Name: AUVSI 2013Date: Aug. 12 - 15Booth No.: 4156Venue: Walter E. Washington Convention Center - Washington, D.C., USA Meet our teamMr. Randy Grijalva, Business Development ManagerRandy_grijalva@innodisk.com Event Name: Flash Summit 2013Date: Aug. 13 - 15Booth No.: 724-726Venue: Santa Clara Convention Center, Santa Clara, CA, USMeet our teamMr. Kok Ten, Senior Product Managerkok_ten@innodisk.com Event Name: Embedded System Conference (ESC)Date: Aug. 27 - 28Booth No.: 611Venue: Transamerica Expo Center, Sao Paulo, BrazilMeet our teamMr. Kok Ten, Senior Product Managerkok_ten@innodisk.com Event Name:The World Leading Defence & Security Event (DSEi)Date: Sep. 10 - 13Booth No.: N2-100Venue: ExCeL London, UKMeet our teamMiss. Joan, EMEA Account Managerjoan_chu@innodisk.com Event Name: Global Gaming ExpoDate: Sep. 23-26Booth No.: 4017Venue: Sands Expo & Convention Center - Las Vegas, NV, USAMeet our teamMr. Chintan Shah, Senior Sales Engineerchintan_shah@innodisk.com

July 2013     nanoSSDInnodisk Leading Next-Generation Industrial-Embedded SATA μSSD Storage The Innodisk nanoSSD is an integrated SATA storage device. It combines Innodisk ID167 NAND flash controller and latest NAND flash in a JEDEC MO-276(SATA μSSD) form factor with one single ball grid array (BGA) package, which makes nanoSSD within a tiny dimension, and very easy to design in. The Innodisk nanoSSD, supporting SATA III 6.0Gbp/s , offers excellent high data transfer rates, along with lower power consumption. It is an ideal solution for any kind of miniaturization applications.   Benefits of nanoSSD ‧ Chip type, easy to design in without mechanical interference‧ SATA interface, highly compatible with x86 system‧ Excellent data transfer rates‧ Fully compliant with industrial standard‧ Suitable for ultra-thin or compact system‧ Zero peripheral circuit Features ‧ Integrated NAND Flash controller with Flash in a single chip‧ Compliant with JEDEC MO-276 (SATA μSSD) specification‧ Adopted SATA III interface with BGA package‧ Extendable DRAM design   Specifications   nanoSSD 3IE nanoSSD 3ME Interface:Flash Type:Capacity:Read/Write (max.):Power consumption:Thermal Sensor:TRIM:Dimension (WxLxH):Operation Temperature: SATA III 6.0 Gb/siSLC2GB~16GB480/175MB/sec0.99W(300mA x 3.3V)Supported Supported16.0 x 20.0 x 2.0mm Standard Grade: 0°C ~ +70°C Industrial Grade: -40°C ~ +85°C SATA III 6.0 Gb/sMLC4GB~32GB480/90MB/sec0.99W(300mA x 3.3V)SupportedSupported16.0 x 20.0 x 2.0mm Standard Grade: 0°C ~ +70°C Industrial Grade: -40°C ~ +85°C