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[공지사항]피닉스컨택트 공식 대리점

2018.07.30

[공지사항]피닉스컨택트 공식 대리점 new

AK정보통신 피닉스컨택트 공식 대리점 협약 완료지난 6월 에이케이정보통신(주)은 피닉스컨택트와 공식적인 업무 협약을 맺고 공식 대리점으로 업무를 시작하였습니다.고객 여러분의 많은 관심 부탁 드리며 자세한 사항은 하기 연락처로 문의 주시면 바로 답변 드리겠습니다.E-mail:sales@goak.co.kr전화번호:02-6093-8888

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[VIA] VIA Embedded Partner Zone Newswire

2012.06.11

[VIA] VIA Embedded Partner Zone Newswire

Ultra Compact, Fanless VIA AMOS-3002 SystemVIA Technologies, Inc, announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA EPIA-P900 Pico-ITX board. The VIA AMOS-3002 provides embedded customers with a system that delivers all the latest features and digital media standards required for a diversified range of embedded applications including telematics, in-vehicle control, machine to machine controller (M2M), digital signage and kiosks.     Fanless VIA ARTiGO A1200 Slim ComputerVIA Technologies, Inc, announced the VIA ARTiGO A1200 slim PC kit, featuring a VIA Eden™ X2 dual core processor. The fanless, ultra-compact VIA ARTiGO A1200 is suitable for a myriad of applications in the home or office, including home server, home automation, hotel management, media streaming, digital signage and surveillance applications.     Why VIA Embedded for COM Express Moduleembedded-news.tvSpeaker: Epan Wu, VIA embeddedAs a chip vendor, VIA has unique position and strength to provide customization service to ODM/OEM customers. By expending product portfolio, VIA Embedded launches COM Express modules with solid roadmap.     VIA EPIA-M910 Dual Core Nano Mini-ITX MainboardMay 11, 2012 | Logic SupplyBrief introduction to VIA's EPIA-M910 Dual Core Nano Motherboard. Has HDMI and PCIe x1 expansion slot.     The following models and corresponding accessories are going to EOL (end of life). If there is any request regarding EOL products, please contact VIA sales representative. Model Last Buy Last Shipment / EOL Date EPIA-NX (Nano-ITX Board) Jun. 30, 2012 Nov. 30, 2012 EPIA-M800 (Mini-ITX board) Jul. 31, 2012 Dec. 31, 2012 EPIA-EX (Mini-ITX board) Jul. 31, 2012 Dec. 31, 2012 EPIA-LT (Pico-ITX board) Jul. 31, 2012 Dec. 31, 2012 VB8001 (Mini-ITX board) Sept. 31, 2012 Dec. 31, 2012 PWB-N550 (DC-DC for Pico-ITX/Nano-ITX) Jun. 30, 2012 Nov. 30, 2012 LVDS-08 (Display module) Jun. 30, 2012 Nov. 30, 2012 DVI-05 (Display module) Jul. 31, 2012 Dec. 31, 2012 HDMI-01 (Display module) Jul. 31, 2012 Dec. 31, 2012   Computex 2012Taipei, TaiwanVIA booth no.: M0311, 4F Nangang Hall RTECC 2012, Americas Montreal, QC, Canada June 14th Ottawa, ON, Canada June 19th Toronto, ON, Canada June 21st Denver, CO July 31st Salt Lake City, UT August 2nd Irvine, CA August 21st San Diego, CA August 23rd

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[VIA]VIA Embbeded Launches AMOS-3002 on May 17 (울트라 초소형 팬리스 VIA AMOS-3002 시스템 출시)

2012.05.21

[VIA]VIA Embbeded Launches AMOS-3002 on May 17 (울트라 초소형 팬리스 VIA AMOS-3002 시스템 출시)

    Features: Dimension: 197mm (W) x 49mm (H) x 104mm (D) VIA 1.0GHz Eden X2 dual core processor VIA VX900H MSP chipset 800 MHz FSB Supports up to 4GB DDR3 1066 204-pin SODIMM Supports hardware acceleration of MPEG-2, WMV9 & H.264 for full HD 1080p display Multiple mounting solutions: Wall/table/VESA Embedded OS ready platform The AMOS-3002 is also available with the use of a EPIA-P830 Pico-ITX board by project. This sku features a 1.0GHz Nano™ E-Series processor for an increased operating temperature range up to 70°C     Comprehensive Dual-sided I/O Interface 2 x Lockable USB 2.0

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[VIA]VIA Embedded Launches COMe-8X91 Computer-On-Module on May 3

2012.05.03

[VIA]VIA Embedded Launches COMe-8X91 Computer-On-Module on May 3

      COMe-8X92 Type 6, compact form factor (9.5 x 9.5 cm) 1.2GHz VIA Nano™ X2 E CPU Supports up to 4GB one DDR3 memory Features one 4-lane PCIe and one 1-lane PCIe expansion Display interface in CRT,18/24-bit single-channel LVDS panel, one DVP and one HDMI   COMe-8X90 Type 6, basic form factor (9.5 x 12.5 cm) 1.2GHz Nano™ X2 E CPU Supports up to 8GB two DDR3 memory Features one 4-lane PCIe and one 1-lane PCIe expansion Display interface in CRT,18/24-bit single-channel LVDS panel, one DP port and one HDMI port     Features: 5.5 x 8.4 cm COM express mini form factor 800MHz VIA Eden X2 processor Supports onboard 1GB DDR3/DDR3L 1066 SDRAM Supports eight USB 2.0 host ports and one USB client port Display interface in 18/24-bit single-channel LVDS panel, and either one DisplayPort or one HDMI port Support two SATA II ports (3Gbps) Features three 1-lane PCIe expansion     Download: COMe-8X91 Product Webpage COMe-8X91 Datasheet COMe-8X91 Image Kit

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[VIA]GE Intelligent Platforms has chosen VIA Processors for its Rugged Solutions of COM Express Modu

2012.04.09

[VIA]GE Intelligent Platforms has chosen VIA Processors for its Rugged Solutions of COM Express Modu

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[VIA]VIA COMe-8X92 Type 6 COM Express Module

2012.04.09

[VIA]VIA COMe-8X92 Type 6 COM Express Module

Measuring 95mm x 95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module Express Compact form factor. The VIA COMe-8X92 module combines a 1.2GHz VIA Nano™ X2 E-Series dual core processor and the VIA VX900H MSP providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage. Features: 1.2GHz VIA Nano™ X2 E CPU Enhanced with VIA advanced VX900H MSP chipset Type 6, compact form factor (9.5 x 9.5 cm) Features one 4-lane PCIe and one 1-lane PCIe expansion Supports up to 4GB one DDR3 memory Display interface in CRT,18/24-bit single-channel LVDS panel, one DVP and one HDMI 4 USB 3.0, 4 USB 2.0 and 1 USB client port (shared with one of USB 2.0 ports) Features: 1.2GHz Nano™ X2 E CPU Enhanced with VIA advanced VX900H MSP chipset Type 6, basic form factor (9.5 x 12.5 cm) Features one 4-lane PCIe and one 1-lane PCIe expansion Supports up to 8GB two DDR3 memory Display interface in CRT,18/24-bit single-channel LVDS panel, one DP port and one HDMI port 4 USB 3.0, 4 USB 2.0 and 1 USB client port (shared with one of USB 2.0 ports)   COMe-8X92 Product Web SiteCOMe-8X92 Product Datasheet (PDF)COMe-8X92 Image Kit   COMe-8X90 Product Web SiteCOMe-8X90 Product Datasheet (PDF)COMe-8X90 Image Kit

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[VIA]VIA First QSeven Module: QSM-8Q90

2012.04.09

[VIA]VIA First QSeven Module: QSM-8Q90

The VIA QSM-8Q90 module measures just 70mm x 70mm and is based on the new embedded QSeven™ form factor developed to meet the demands of various low-power and mobile applications. Featuring a 1.0GHz VIA Nano E-Series processor and the VIA VX900 MSP, the VIA QSM-8Q90 is the ideal building block for power constrained handheld application segments, including medical, advanced gaming, military and test and measurement equipment.   Features: 70mm x 70 mm QSeven form factor  1.0GHz VIA 64-bit Nano™ E processor 1 GB onboard DDR3 800MHz system memory Integrated VIA Chrome9™ HD DX9 3D/2D graphics with VC1, MPEG-2, WMV9 and H.264 decoding acceleration Supports two SATA ports (3Gbps) Display interface support for one single channel 18/24-bit LVDS connector with resolution up to 1,366 x 768  Features two 1-lane PCIe expansion Supports one Gigabit Ethernet on module Up to 8 USB 2.0 ports, where one may be used as USB 2.0 client port   Solutions & Applications: Mobile handheld Medical Test & Measurement Military Gaming   Start-up kit: QSM-8Q90 board Multi-I/O baseboard reference 7” LDVS display VIA’s extensive technical support in developing a custom baseboard   Download: QSM-8Q90 Product Page QSM-8Q90 Datasheet (PDF) QSM-8Q90 Image Kit

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On-Line DDR2

2012.04.04

On-Line DDR2

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On-Line DDR1

2012.04.04

On-Line DDR1

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On-Line SDRAM

2012.04.04

On-Line SDRAM

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On-Line SD card

2012.04.04

On-Line SD card

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On-Line SATADOM

2012.04.02

On-Line SATADOM

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On-Line SATA Slim

2012.04.02

On-Line SATA Slim

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On-Line SATA SSD

2012.04.02

On-Line SATA SSD

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[VIA]VIA Embedded Launches Its First QSeven Module QSM-8Q90 on March 22

2012.03.22

[VIA]VIA Embedded Launches Its First QSeven Module QSM-8Q90 on March 22

  Features: 70mm x 70 mm QSeven form factor 1.0GHz VIA 64-bit Nano™ E processor 1 GB onboard DDR3 800MHz system memory Integrated VIA Chrome9™ HD DX9 3D/2D graphics with VC1, MPEG-2, WMV9 and H.264 decoding acceleration Supports two SATA ports (3Gbps) Display interface support for one single channel 18/24-bit LVDS connector with resolution up to 1,366 x 768 Features two 1-lane PCIe expansion Supports one Gigabit Ethernet on module Up to 8 USB 2.0 ports, where one may be used as USB 2.0 client port   Solutions & Applications: Mobile handheld Medical Test & Measurement Military Gaming   Start-up kit: QSM-8Q90 board Multi-I/O baseboard reference 7” LDVS display VIA’s extensive technical support in developing a custom baseboard   Download: QSM-8Q90 Product Page QSM-8Q90 Datasheet (PDF) QSM-8Q90 Image Kit

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[VIA]The VIA EPIA-M910 is the ideal solution for a wide range of embedded applications featuring one

2012.03.12

[VIA]The VIA EPIA-M910 is the ideal solution for a wide range of embedded applications featuring one

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[VIA]Most power efficient x86 quad core solution available on the market, targeted for immersive HD

2012.03.12

[VIA]Most power efficient x86 quad core solution available on the market, targeted for immersive HD

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[VIA]Join VIA at Embedded World 2012 for the first glimpse of the VIA COMe-8X90 module

2012.03.12

[VIA]Join VIA at Embedded World 2012 for the first glimpse of the VIA COMe-8X90 module

VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90   Join VIA at Embedded World 2012 for the first glimpse of the VIA COMe-8X90 module   Taipei, Taiwan, 24th February, 2012 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage. Measuring 95mm x 125mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles. Along with the VIA COMe-8X90 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions. “Embedded modules are ideal for creating highly tailored solutions with a short time to market approach,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA COMe-8X90 module provides customers with an easily customizable platform with power efficient processing and rich I/O options, allowing them to quickly create optimized products for their target markets.” The VIA COMe-8X90 module will be on display at the VIA Embedded booth in Hall 1 of the Embedded World 2012 Exhibition and Conference, which is being held in Nuremberg, Germany fr|om February 28th to March 1st, 2012. In addition, VIA will be presenting the latest embedded Android and x86 multi-core solutions for next generation embedded applications.   VIA COMe-8X90 Module   Available in the industry standard COM Express form factor of 95mm x 125mm, the VIA COMe-8X90 module includes a 1.2GHz VIA Nano X2 E-Series dual core processor and a VIA VX900H MSP, which features the VIA ChromotionHD 2.0 video engine, boasting hardware acceleration of the most demanding video formats, including MPEG-4, H.264, MPEG-2, VC-1, WMV and Blu-ray support, for incredibly smooth playback of multimedia titles at resolutions up to 1080p. The VIA COMe-8X90 module offers support for the latest connectivity standards including 18/24-bit single-channel LVDS, VGA, Display Port and HDMI. Onboard I/O includes two SATA II ports, one GigaLAN port, one USB client port, four USB 2.0 ports, SDIO, expansion buses for one PCIe X4 and one PCIe x1 and the VIA Labs VL800 USB 3.0 host controller which offers support for four USB 3.0 ports. System memory support includes two slots for up to 8GB of SODIMM DDR3 RAM.   For more information about the VIA COMe-8X90module please visit:http://www.viaembedded.com/en/products/boards/productDetail.jsp?productLine=1&id=1571&tabs=1   For images related to this release please visit:http://www.viagallery.com/index.php?option=com_flickr4j&Task=sets&Set=72157629433520789&Page=1

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[VIA]VIA Embedded Announces COMe-8X90

2012.02.27

[VIA]VIA Embedded Announces COMe-8X90

  Features: 1.2GHz Nano™ X2 E CPU Enhanced with VIA advanced VX900H MSP chipset Supports two DDR3 and up to 8GB memory size Supports four USB 3.0 Features one 4-lane PCIe and one 1-lane PCIe expansion Display interface in CRT, 18/24-bit single-channel LVDS panel, one DP port and one HDMI port VIA COMe-8X90 Product and Service Product Web Page Datasheet Image Kit Highly Integration Platform • Powered by 1.2GHz Nano™ X2 E processor • Adopts MicroATX carrying board to meet standard for function and evaluation • Rich I/O supports included: 1 x HDMI, 1 x DisplayPort, 1 x VGA, 1 x LVDS, 1 x GigaLAN, 4 USB 3.0, 4 USB 2.0 and 1 USB client port Technical Services & Longevity Support • Up to 7 year product lifecycle • Responsive global customer support service • Start-up kit support with a multi-I/O carrying board reference Small but Rugged Design Ideally for a Host of Embedded Applications • Medical & Healthcare • Gaming • Industrial PC • Transportation     Copyright © 2012 VIA Technologies, Inc. All Rights Reserved.

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[VIA]Android OS on VIA x86 Board Demo

2012.02.23

[VIA]Android OS on VIA x86 Board Demo

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[VIA]10th Anniversary of Mini-ITX

2012.02.23

[VIA]10th Anniversary of Mini-ITX

 

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