Innovating Today’s Industrial Grade Storage for Tomorrow's Challenges April 11, 2013, Taipei, Taiwan – Innodisk, a leading designer and manufacturer of industrial flash and DRAM storage products, will be exhibiting at DesignWest in San Jose, CA fr|om April 22-25. Innodisk invites media, industrial partners and attendees wishing to further their technical knowledge to visit its booth, #1924 at the San Jose McEnery Convention Center.  Innodisk will have its newest products and designs that it has developed to meet the current challenges facing engineers with embedded applications, including: SATA III interface industrial flash devices and back-end designs that optimize MLC NAND Flash. SATA III is on the cutting-edge for the industrial market, as it is currently not prevalent for industrial applications. Innodisk's SATA III products offer superior speeds, while consuming about the same amount of power as SATA II products. This allows those with embedded designs to incorporate faster speeds without significant increases in power consumption.The full range of Innodisk products will be on display at the booth, including SATADOM, SSD, mSATA, CFast, SATA Slim and NGFF form factors. Additionally, Innodisk will be showcasing a live demonstration of its SATA III SATADOM, the world's smallest industrial storage form factor, running Innodisk's exclusive monitoring technology, iSMART. Also on display at the Innodisk booth will be products with the newly developed proprietary flash memory storage firmware, iSLC, which optimizes superior MLC NAND Flash to ensure longer lifespans and more reliable performance for SSDs. With this technology industrial users receive similar write speeds and data quality as SLC-based technologies at a more competitive price point.  A recently released white paper on iSLC is available for download, with a more in-depth look at the technology and how Innodisk uses it to revolutionize its SSDs for the industrial embedded marketplace.

Ultra low power design with optional 3G connectivity and battery power support ideal for a broad range of in-vehicle and mobile applications   Taipei, Taiwan, 30th April, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-600 Pico-ITX embedded board. Featuring an 800MHz ARM Cortex-A9 processor, the VIA VAB-600 combines a wide operating temperature range (0°C up to 60°C) with extremely low power consumption and optional 3G connectivity to fuel in-vehicle innovation as well as a broad range of mobile and healthcare applications. The VIA VAB-600 Pico-ITX board features a rich I/O set with superb multimedia performance, including a built-in Multi-standard decoder for playback support of the most demanding video formats in resolutions up to 1080p. Leveraging VIA’s hardware design expertise, the VIA VAB-600 includes a broad range of on-board pin-headers to provide optional 3G or WiFi connectivity, touch screen support and support for either battery or 12V~24V DC-in power options in an ultra-compact design. Customers can take advantage of VIA’s worldwide embedded software development expertise to quickly create customized designs for a fast time-to-market approach and is available as a hardware starter kit. Board support packages (BSPs) for either Android (4.0) or Embedded Linux (Kernel 3.0.8) operating systems are also available. “The VIA VAB-600 Pico-ITX allows our customers to jump start innovation for in-vehicle and mobile applications,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “By leveraging our starter kits and customization expertise, customers are provided with a flexible development path to quickly and easily bring new products to market.”   VIA VAB-600 Pico-ITX   Based on the ultra compact Pico-ITX form factor, measuring 10 cm x 7.2 cm, the VIA VAB-600 combines an 800MHz ARM Cortex-A9 processor with a built-in 2D/3D graphics engine, supporting OpenGL® ES 2.0, to deliver a smooth user experience and superb multimedia performance. Customers can leverage our starter kits which include a VIA VAB-600 Pico-ITX board, VAB-600-A I/O card, VAB-600-C TTL Converter card, 7” touch screen TTL panel, cables and 18W AC adaptor. Rear I/O includes one Mini HDMI port, two Mini-USB 2.0 ports, one 10/100 Ethernet port and 1 12~24V DC-in jack. On-board features include 4GB eMMC Flash memory, 1GB DDR3 SDRAM, one DVO connector for TTL or LVDS display, two COM ports, SPI, one USB 2.0 connector, one Mini Card slot (supports USB 2.0 connectivity for optional WiFi module VNT9271B6050), support for one SIM card slot, touch screen connector, front pin headers for line-in/out and MIC-in, I2C and GPIO pin header, and one battery charger connector with smart battery function.   For more information about the VIA VAB-600 Pico-ITX, please visit:http://www.viaembedded.com/en/products/boards/2070/1/VAB-600_(Pico-ITX).html   For more information about our VIA VAB-600 evaluation kits, please visit:http://www.viaembedded.com/en/downloads/EvaluationKit.jsp   For images related to this release, please visit:http://www.viagallery.com/Products/via-vab-600-pico-itx-board.aspx

VIA to showcase full range of products in the Jampel booth at Embedded IC & Automation Fortronic 2013   Taipei, Taiwan, 22 April, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced that it has signed a distribution agreement with Jampel, the top embedded distributor in Italy. The agreement gives Jampel the ability to promote, distribute, market and sell the full line of VIA Embedded products throughout Italy. VIA will be demoing a full range of products this April 23rd as part of the Jampel booth at Embedded IC & Automation Fortronic 2013, in the Centre Congressi Milanofiori, Milan. \"Jampel embedded customers are increasingly searching for low power, complete solutions in both x86 and ARM architectures to match the demands of the evolving market,” said Maurizio Di Banella, President of Jampel S.r.l.. “Our partnership with VIA technologies allows us to significantly widen our embedded product and solution offerings, guaranteeing our customers industry leading technology, reliability, quality and support.”   Headquartered in Bologna, Italy, Jampel is the leading distributor of passive electronic components and embedded systems across Italy. With over 20 years of experience, Jampel has been driving innovation in transportation and public administration infrastructure with their leading value-add system integration.   “VIA has always maintained very high standards when working with distributors. We are happy to say that Jampel easily meets these standards as a world-class embedded systems supplier,” said Epan Wu, Head of VIA Embedded, VIA Technologies, Inc. “With their dynamic approach, technical know-how and strong co-working model with vendors, Jampel is the ideal partner for extending our brand across the Italian market.”   For more information about Embedded IC & Automation Fortronic 2013, please visit:http://www.fortronic.it/page.asp?pag=1282&eveid=293&ln=2

VIA Come-8x80(with custom carrier board)으로미국 GE healthercare 마취 장비에 적용이 되었습니다.     하기 사이트에서 실물 확인이 가능합니다. http://www3.gehealthcare.co.uk/en-GB/Products/Categories/Anesthesia_Delivery/Avance_CS2_with_ecoFLOW   The VIA COMe-8X80 is a fanless*1 COM Expressform factor module that offers full 64-bit computing and high performance multimedia features suited for a variety of next-generation embedded applications. Available with a choice of 1.3GHz or 800MHz VIA Nano processors the VIA COMe-8X80 also integrates the unified VIA VX800 media system processor, replacing the traditional chipset with a unified single chip solution. The VIA VX800 incorporates VIA Chrome9 integrated graphics with support for VGA, and dual channel LVDS displays. Targeted at industrial PC and large OEM customers focused on dynamic application segments, including advanced gaming, industrial automation and digital signage, customers can take advantage of a proprietary multi-I/O baseboard, or can utilize VIA\'s extensive technical support in developing a custom baseboard. Measuring 95mm x 125 mm, COM Express is an industry standard embedded form factor developed by the PICMG (PCI Industrial Computer Manufacturers Group) to provide greater connectivity and data transfer bandwidth than the original COM (Computer-on-Module) standard. The COM Express specification integrates core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O baseboard.   VIA COMe-8X80 Product Highlights:   High performance VIA Nano processor 18/24-bit dual channel LVDS plus VGA Three PCI, and one x4 plus two x1 PCIe slots Up to 2GB of DDR2 10/100Mbps Fast Ethernet Up to six USB 2.0 ports Up to two SATA devices plus 1 IDE

Innodisk to Showcase SATA III Industrial Flash Devices and MLC Optimizing Back-End Designs at Storage Networking World Spring 2013   Taipei, Taiwan – March 28, 2013 - Innodisk, a designer and manufacturer of SSDs for industrial applications, will be exhibiting at Storage Networking World (SNW) Spring 2013 in Orlando, Florida fr|om April 2-4. Innodisk invites media, industrial partners and all other interested parties to booth, A3, at the Rosen Shingle Creek Hotel to see the new products and designs that Innodisk has developed to meet the current challenges of data centers designers and users of industrial storage face, including: SATA III interface industrial flash devices and back-end designs that optimize MLC NAND Flash. While SATA III is common in consumer circles, it is a new trend for the industrial market. Innodisk's SATA III products offer superior speeds, while consuming less power than SATA II products. This provides the storage networking community the ability to reap speed benefits without sacrificing their power consumption conservation efforts. The full range of Innodisk's products will be on display at the booth, including SSD, mSATA, CFast, SATA Slim and NGFF form factors. Additionally, Innodisk will have its SATA III SATADOM, the world's smallest industrial storage form factor, at SNW Spring 2013. Innodisk will also be displaying products with its newly developed proprietary flash mem Visitors to Innodisk's booth will also be able to learn more about iSMART, a powerful monitoring tool that allows system integrators to track important disk information, such as temperature, storage space, bad blocks, and lifespan of the drive. With the ability to anticpate the end of the disk's life cycle, system integrators can transfer their valuable data and replace the disk drive. Innodisk invites all to visit booth A3 at SNW Spring 2013 to see and learn about the new technologies the company is implementing in the storage networking community.

Innodisk Initiates New Trends for 2013 in Industrial Flash Memory   The year 2012 was a big year for solid state drives (SSDs), which remained a bright spot in the storage world. According to a report released by information and analytics provider IHS iSuppli, unit shipments of SSDs throughout the year 2012 increased 1.29-fold fr|om 2011. However, in the industrial control segment, the fantastic growth of SSDs is accompanied with dramatic changes. Facing up to the changes in the marketplace, Innodisk, a major SSD provider for industrial applications, has prepared many technical innovations which have gathered great momentum to release in the year 2013.   Adoption of Multi-Level Cell (MLC) Flash memory has grown at a pace faster than expected. Yet, MLC flash has inherent limitations as a result of manufacturing yield issues, which need to be remedied by back-end designs of SSD devices. Innodisk has prepared solutions to solve these problems and further explored the potential of MLC Flash.   Secondly, SATAIII, which nearly doubles the read/write speeds of SATAII, has already become a mainstream data connection interface for consumer-grade products, and is currently emerging in the industrial application segment.  We believe that SATAIII will definitely become mainstream for industrial SSDs in the future as well. During the past half year, Innodisk has taken an aggressive pace and allocated more R&D resources to develop SATAIII SSDs. The company introduced its first 2.5” SATAIII SSD product line in the first quarter of this year, and will release miniaturized SATADOM and mSATA products also based on SATAIII later this year.   On the other hand, the trend of miniaturization continues. With the assistance of the Next Generation Form Factor standard stipulated by Intel (Intel NGFF), which helps to multiply the read/write speeds of smaller mSATA products, some key players in the market have been encouraged to adopt miniaturization. Miniaturization will definitely become unstoppable in 2013. Innodisk, which has already gained a market foothold in producing miniaturized modules, with its most important product line called SATADOM based on patented Pin 7 technology, will also introduce miniaturized products based on NGFF specification later this year.     Trend 1: Backend designs will determine the overall performance of Flash memory   The growth in popularity of SSDs and their ever increasing applications have resulted correspondingly in aggressive improvements in the Flash memory manufacturing process, making Flash memory much cheaper than ever. In the past, the industrial control segment preferred Single Level Cell (SLC) Flash memory due to its high reliability. However,  MLC Flash is now gaining an edge with much more competitive pricing. Many light industrial applications now opt for MLC memory, which has resulted in the quick rise of MLC in the industrial market.   Though having an advantage in pricing, MLC Flash is facing many challenges when it comes to adoption among the industrial segment. Most of these challenges originate fr|om the innate limitations of MLC, and the most fatal ones are its inferior reliability and endurance. Because MLC Flash memory requires more constrained voltage ranges, it is more susceptible to Error Correction Code (ECC) errors than SLC Flash memory and needs more ECC corrections to ensure accurate data storage. Therefore, MLC Flash memory is less reliable than SLC and has a shorter data retention lifetime.   More notable but often neglected is the fact that, with the production process scaling of Flash memory (to increase yield and reduce cost), MLC is facing quality degradation. When the process is scaled down fr|om 3X nm to 2X nm, the Programming/Erase Cycle (P/E Cycle) of MLC Flash memory drops for 60% fr|om ~5k to ~3k. The process scaling has also resulted in the need for more ECC bits: 2X nm MLC Flash requires 24 ECC bits, while 1X nm process requires 40 ECC bits—almost double.   When an increasing number of industrial customers prefer quality-degrading MLC Flash devices over SLC out of cost concerns, design of the backend module house becomes important in remedying the disadvantages of MLC. Innodisk has developed a series of leading technologies to solve the innate disadvantages of MLC Flash, such as using thermal sensors to aid in remedying MLC flash’s vulnerability to temperatures outside of its normal operating range. When a sensor detects the temperature dropping past a certain threshold, a thermal pad will start to heat up in order to maintain normal operating temperatures and ensure the reliability of the Flash memory and the device.   Innodisk excels at using firmware and hardware design to optimize endurance and reliability of original manufacturers’ products. One example is the iSLC technology-based SSDs it introduced in the final quarter of last year, which greatly enhanced the performance, reliability and endurance of MLC Flash through firmware design.   According to the technical aspects of Flash memory, each MLC Flash cell can store 2 bits of information, representing 4 distinct states: 00,01,10,11; while SLC Flash stores 1 bit value per cell, which can be interpreted as 2 distinct states: 0,1. Innodisk’s self-developed iSLC technology adjusts MLC-based Flash firmware to allow each MLC Flash cell to represent only 2 states, “0”or “1”, similar to that of SLC Flash.   Cc Wu, director of Embedded Flash Div., says, “We have the outstanding ability for choosing the best MLC Flash memory, and we know how to use our proprietary firmware technologies to allow our iSLC products to perform at almost the same level as SLC-based products with reliability and service lifetime similar to SLC-based products, all while maintaining a lower price.”   On the other hand, a good storage device monitoring tool is also very important. Innodisk’s newly revised iSMART 3.0 can monitor all storage devices in a system, allowing users to check read/write speeds and remaining life span of each storage device. This monitoring tool can also display storage device operation status and alert users of the remaining service lifetimes so that they can replace a disk in time. The latest iSMART version can also visualize SSD Wear-Leveling status with graphics.   Trend 2: SATAIII adoption is to rise in industrial control applications in 2013   SATA III (6.0 Gb/s) is a data connection interface standard stipulated by Serial ATA Working Group in 2009 allowing for backward compatibility with SATA II and SATA I, which is already a main implementation for consumer products. However, in the area of industrial control, where reliability is a priority, SATA II is still the norm.   However, as the SATA III specification is implemented for years in the consumer market, relevant technologies are getting quite mature. Considering its theoretical 600 MB/s high data transfer speed, we believe that SATAIII has become suitable for industrial applications.   Innodisk tested SATA III SSD performance on a SATA II platform, and found two-fold increase in read/write speeds of storage devices. Innodisk has spent half a year on developing SATA III devices, including finding ways to implement slumber and sleep modes for power-efficiency purposes. Innodisk is slated to introduce its SATA III product lines in the first half of this year, including SSD, SATADOM, mSATA, CFast, SATA Slim and NGFF.   Trend 3: Miniaturized devices will become mainstream   The miniaturization trend has been happening not only in the consumer market but also in the industrial control market as well. It is expected to become the norm in the industrial sector in this coming year.   Currently, industrial control applications ask for more space-saving host board designs, especially when an increasing number of mobile devices opt for smaller form factor designs that further constrain the space of host boards. Miniaturization is a trend that has been happening for years, with mSATA being the mainstream specification for miniaturized devices in the past. However, mSATA is not a good option for mass storage due to the constrained amount of Flash memory that can be deployed on a printed circuit board (PCB).   Yet, the Next Generation Form Factor (NGFF) stipulated by Intel including the SSD slot standard will be able to ease space constraints and enable a dramatic increase in data transfer speeds, which will be helpful in developing more storage devices of 2GB-16GB capacities—currently the mainstream requirements in industrial control. Intel NGFF has already been recognized and implemented by a number of major memory manufacturers, and Innodisk, a leader in miniaturized products renowned for its SATADOM series, will follow this new standard and introduce NGFF-based products in the second half of the year.   Innodisk utilizes its own technological know-how to develop world-leading data storage devices and memory modules which meet the strict requirements of mission-critical applications in aerospace, national defense, factories and embedded systems, with unique functionalities, forms and firmware designs. Our hardware, software and firmware specialists are ready to team up at any time to provide custom-tailored solutions that best meet our customers’ needs.

Innodisk to show full industrial SATA III storage range at Embedded World 2013   Taipei, Taiwan - February 21, 2013 – Innodisk, an industry-leading manufacturer and solution provider of industrial embedded flash and DRAM storage products and technologies, will be showing its new range of products for 2013 at the Embedded World 2013 exhibition and conference fr|om 26–28 February in Nuremberg, Germany. Innodisk's complete series of industrial SATA III products includes SSD, SATADOM, SATA Slim, mSATA, and CFast, with a wide variety of form factors and interfaces. With SATA III, Innodisk products can offer sequential read and write speeds two times faster than SATA II, to satisfy almost any embedded systems requirement. Products on display at the Innodisk booth in Nuremberg will also include the Innodisk InnoRobust series of SATA SSDs which are compliant with military standards for ruggedness, durability and reliability in even the most extreme operating environments. Building on its research and development strengths, with the upgrade to SATA III, Innodisk offers support for temperatures ranging fr|om -45°C to 85°C, customized firmware for specific system applications ranging fr|om entertainment to aerospace, power outage data protection and other advanced functions, moving the industrial PC application market forward into the next generation. As well as almost doubling read and write speeds, the upgraded SATA III 2.5-inch SSDs provide a lower power design with enhanced power saving sleep modes. New products are expected to be on the market in March 2013. Innodisk turns a product into a true solution with the exclusive iSMART disk health monitoring tool to protect customer's investments in SSDs and HDDs. Powerful and easy-to-use, iSMART does not just display passive information and a disk lifespan prediction, but can also save hours of setup and maintenance time by giving users easy one button access to write-protection, ATA Security, quick erase, and power saving features. Innodisk will also be introducing advanced LR-DIMM memory modules for capacities up to 64GB. With Innodisk 64GB 1333MHz LR-DIMM, servers can break through existing memory capacity constraints for improved performance, greater reliability, and lower operating costs. Finally meeting the demanding requirements of the latest cloud computing applications, these exciting new products are expected to be on the market in the second quarter of 2013. As well as these new products, Innodisk will be showing other popular products and recent innovations fr|om its existing range. These devices feature iSLC technology that greatly extends the lifetime of NAND flash with similar performance of SLC-based flash, but at a significantly lower cost. There will also be DRAM products with support for the ARM architecture, 32 bit modules, rugged mounting pads, and module height of 17.9mm for small form factor systems. With a very wide range of popular products and new innovations to offer, Innodisk welcomes your questions, advice and comments, and looks forward to meeting friends fr|om the industry, as well as potential new customers, at Embedded World 2013.

VIA Showcases VIA Vantage Digital Signage Solutions @ DSE 2013   Signage solutions fr|om A to Z including multiscreen video walls and interactive touch displays to turnkey x86 and ARM based solutions Taipei, Taiwan, 21 February, 2013 - VIA Technologies, Inc. today announced it will be showcasing the full range of VIA Vantage digital signage solutions at Digital Signage Expo (DSE) 2013, in the Las Vegas Convention Center, booth #1248, this February 27-28. Ranging fr|om a massive 16-screen video wall to ultra-compact interactive touch display systems, the VIA Vantage line provides customers with an unrivaled choice of customizable systems ideal for a broad spectrum of environments. Also on display will be solutions integrating Capital Networks Audience software for both Windows and Android platforms as well as a dynamic multiscreen menu board enabled through our partnership with Popstar Networks.   “This past year has seen an amazing growth in the DOOH market as consumer expectations have come to demand heightened engagement in traditional brick & mortar and an ever increasing number of public spaces,” said Epan Wu, Head of VIA Embedded, VIA Technologies, Inc. “Customers can partner with us fr|om A to Z in the creation of customized VIA Vantage solutions which reimagine how screens can be utilized to draw in and engage their audience.”   For more information about VIA Vantage digital signage solutions, please visit:http://www.viaembedded.com/en/solutions/DigitalSignage.jsp   For more information about DSE 2013, please visit:http://www.digitalsignageexpo.net/

VIA Showcases Eye-Catching 16-Screen VIA Vantage Digital Wall at DSE 2013   VIA Showcases Eye-Catching 16-Screen VIA Vantage Digital Wall at DSE 2013   Unrestricted stitching feature for innovative mosaic displays in resolutions of up to 4K ultra-HD   Taipei, Taiwan, 28 February, 2013 - VIA Technologies, Inc. will be showcasing a massive VIA Vantage Digital Wall composed of sixteen 46” super slim displays at the Digital Signage Expo (DSE) 2013, in the Las Vegas Convention Center, booth #1248, this February 27-28. The VIA Vantage Digital Wall is a fully customizable solution with the use of either high-definition LCD displays or LED panels to better match the needs of any indoor or outdoor space and supports resolutions of up to 4K ultra-HD for rich life-like images, videos, animations, and other artistic effects. Incorporating an unrestricted stitching feature, customers can freely combine panels in innovative new patterns to create mosaic-like displays which can run up to six independent 1080p videos simultaneously in the most popular formats including H.264, MPEG2, MPEG4, VC1, WMV9, WMV, AVI, MKV, ASF, FLV and DVR-MS. A user-friendly drag and drop interface with unique big screen stitching capabilities makes content management and scheduling a breeze. With this flexibility customers are free to arrange content across multiple screens to deliver the maximum impact in a diverse range of environments such as airports, bus and train stations, hotels, museums, offices, shopping centers, movie theaters and a host of other public spaces. “Many customers are increasingly looking for innovative ways to incorporate digital signage into the fabric of traditional spaces to create engaging new experiences for consumers,” said Epan WU, Head of VIA Embedded, VIA Technologies, Inc. “In Taiwan the widespread adoption of the VIA Vantage Digital Wall has already begun to reshape the market landscape and we believe that it has huge potential for exciting new deployments throughout the rest of the world.”   For more information about VIA Vantage Digital Signage solutions, please visit:http://www.viaembedded.com/en/solutions/DigitalSignage.jsp   For images related to this press release, please visit:http://www.viagallery.com/Products/via-vantage-digital-wall.aspx

    VIA ARMTiGO A800 Fanless and low profile design (only 3cm high) Powered by Freescale Cortex-A8 single core i.MX537 with Pico-ITX board 4GB onboard eMMC Flash memory Supports 1GB x DDR3-800 SDRAM memory size Standard temperature support fr|om 0°C to 50°C Supports Android and Linux Ubuntu Supports HDMI, VGA, LAN, 4 USB 2.0, 1 Micro SD slot and wireless module (optional) >> ARMTiGO A800 Product Website >> ARMTiGO A800 Datasheet (PDF) >> ARMTiGO A800 Image Kit  

InnoDisk iSLC Series Offers New Cost-effective Option for Solid State Drives   (TAIPEI, Taiwan - November 19, 2012) - InnoDisk, a worldwide leading manufacturer of industrial data storage solutions, is proud to announce a series of flash products with a new and exclusive technology-- iSLC [2IE series], designed to outdo the endurance, performance and reliability of MLC-based solutions. Through the use of flash management algorithms, iSLC improves SSD endurance up to 30,000 times, increasing lifespans to at least 10 times longer than MLC-based solutions. In addition, iSLC improves the performance of solid state drives, with similar write performance of SLC-based solutions, and with data quality that is on par with SLC technologies. The InnoDisk iSLC series is extremely cost efficient, boasting excellent benefits at only half the price of SLC-based solutions. For many years, the flash industry has known SLC NAND flash to be more reliable and maintain longer endurance than MLC, and was in turn accepted it as the best choice for industrial and enterprise applications, albeit at the expense of increased costs. While MLC flash has become attractive in recent years as a cost-saving alternative to SLC, both the endurance and performance will almost certainly decrease in the near future. To compensate for flash technology node progression (fr|om 4xnm to 2xnm), flash manufacturers would need to specify more error correction code (ECC) to achieve a higher endurance. According to recent testing data, 5xnm MLC requires ECC capabilities to be 8 bits, while 2xnm MLC requires that ECC capabilities be increased to 24 bits. InnoDisk is disrupting the industry, providing an answer amid economic concerns, with new iSLC technology, the 2IE product series. Delivering greater endurance, and nearly SLC performance According to our testing results, 2IE products with iSLC can estimate to sustain 32GB capacity drive writes per day for 7.6 years, outdoing the MLC drive at least 10 times. InnoDisk prides itself in the ability to customize our products to your needs. We´ve developed the 2IE series with different form factors, including 2.5" SATA SSD, mSATA, SATASlim and CFast. For example, the capacity of the SATA SSD 2.5" 2IE ranges fr|om 16GB to 256GB, supports SATA II interface, and has sequential read and write speeds of up to 240/220 MB/sec with 8 channels. This is comparable with the SLC performance of similar products (for reference, SLC sequential read and write speeds are up to 250/230 MB/sec with 8 channels). With a variety of form factors, customized firmware solutions, and innovative R&D capabilities, InnoDisk is the best solution for all of your industrial storage needs.

Innodisk Announces Rebranding and New Corporate Visual Identity   Taipei, Taiwan - January 2, 2013 - Innodisk has officially announced the completion of a recent corporate-wide rebranding program. This rebrand, which includes the launch of Innodisk’s new visual identity and new corporate communications, marks a significant transformation of the Innodisk brand, reflecting the company’s drive to become a service-driven global leader in the industrial embedded memory industry. Innodisk’s new corporate identity system features a redesigned logo, with the Innodisk name now written in lower case and framed in red. This new logo represents Innodisk’s dedication to delivering the best service in an industry where service is what customers demand most. The new logo also uses a single color theme to reinforce the company’s focus on doing one thing at a time, and doing it well. In addition, the vibrant red color of the logo symbolizes Innodisk’s enthusiasm for service while the lower case font represents the company’s friendly, approachable spirit. And a small red block on the upper right side of the logo stands for Innodisk’s promise to its partners to continually improve while continuing to do more for them. All in all, the new logo reflects the true spirit of Innodisk—passionate, yet humble, and always thinking ahead when helping customers. Richard Lee, the chairman of Innodisk, commented, “Through this rebranding process, we’ve redoubled our efforts to provide exemplary service to our customers and business partners.” He continued, “We believe that helping our clients achieve success is worth the time and effort.” Lee concluded, “fr|om the beginning, Innodisk has dedicated itself to becoming a world-class flash storage and DRAM module company that focuses on helping our customers and partners to be successful and make a profit. This rebranding process has solidified our commitment to a service-oriented business model, and we have stayed true to our vision.” Throughout the company’s history, Innodisk has consistently evolved and expanded, reengineering its own internal processes to ensure that it remains at the forefront of the industry. In the past 5 years in particular, Innodisk’s operations have seen tremendous growth. During this time, Innodisk has extended its product offerings through acquisitions, including the recent integration of Actica’s server storage products. It has also expanded production lines and increased investment in quality-testing machinery. The decision to rebrand was very much strategic for Innodisk, as it comes hand-in-hand with the company’s preparations for an IPO launch in late 2013. The rebranding process has helped to prepare each of Innodisk’s departments for the company’s continued growth, which is being fueled by the company’s service-oriented approach. In particular, Innodisk has launched an Absolute Service campaign to reinforce the company’s dedication to its customers. As part of its commitment to Absolute Service, Innodisk has upgraded its internal operations, making it even easier for customers and business partners to contact the Innodisk team and access crucial information.

  VIA Enables Medical OEMs to Take Advantage of Exciting Growth Opportunities in Medical Market   Combines widest range of x86 and ARM platforms with unrivaled longevity and exceptional software development support Taipei, Taiwan, 20th December, 2012 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced tit enables medical OEMs to take advantage of the exciting growth opportunities in the medical market by offering the widest selection of low-power x86 and ARM based solutions on the market. VIA provides fully customizable application ready platforms together with extended software and firmware services which medical OEMs can leverage for a wide range of medical usage models and applications including ultrasound, diagnostics, POC (Point of Care) terminals, patient monitoring, therapeutic, as well as exercise and fitness equipment. With a long history as a full-service medical OEM solutions provider to many of the top industry players, VIA provides a robust medical roadmap which includes a full range of COM Express, ETX and QSeven system on modules, embedded mainboards in Mini-ITX and Pico-ITX form factors, and embedded systems based on VIA AMOS and VIA ARTiGO designs, as well as a full line of medical-grade touch displays with the VIA ALMA-3000 series. VIA also offers unparalleled longevity support for increased lifecycle management, support for a wide range of software and board operating systems and support for critical medical standards including UL-60601, EN-60601 and medical QMS (Quality Management System) ISO-13485. This enables customers to deliver products with unique feature-set advantages and a faster time-to-market.   “Medical OEMs are faced with many challenges, including compliance with rigid safety standards, in creating products with additional features and differentiators for the market,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “Through partnering with VIA, our OEM customers can leverage our experience, expertise and resources to create sustainable competitive advantages within the rapidly growing medical market.” VIA Medical Solutions As a full service medical OEM solutions provider, VIA uniquely offers the widest selection of low-power x86 and ARM based solutions at the board, module, system and platform level, together with a comprehensive line of medical specific I/Os and technologies. With a flexible business model, manufacturing excellence and compliance with high quality and environmental standards, OEM customers can leverage the experience, expertise and resources of VIA to focus on their value-adds and create key differentiators.   VIA System on Modules   VIA ETX Module VIA COM Express Module in Compact, Mini and Basic Form Factor VIA QSeven Module   VIA Embedded Mainboards   VIA Mini-ITX VIA Pico-ITX VIA ARM-based VAB Series   VIA Embedded Systems   VIA ARTiGO Series VIA AMOS Fanless Series   VIA Medical-Grade Touch Displays   VIA ALMA-3000 Series   For more information about VIA Medical solutions and services please visit:http://www.viaembedded.com/en/solutions/Healthcare-and-Medical-Computing-Solutions.jsp

VIA Announces Ultra Compact VIA ARMOS-800, First ARM Based Industrial System   Delivers extreme power efficiency in a ruggedized chassis system for a diversified range of embedded applications   Taipei, Taiwan, 15 January, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARMOS-800, an ultra-compact, fanless system designed around the tiny VIA VAB-800 Pico-ITX board. The VIA ARMOS-800 provides embedded customers with a ruggedized system that delivers advanced multimedia features in an extremely power efficient design for a diversified range of embedded applications. Featuring an 800MHz Freescale ARM Cortex-A8 SoC with two integrated GPUs for dual display support, the VIA ARMOS-800 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range fr|om -40°C to 80°C , the VIA ARMOS-800 delivers a typical power consumption of a mere 3.14W TDP. "The VIA ARMOS-800 is the first ARM-based system in our ruggedized AMOS systems series," said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. "The high performance and ultra-low power consumption provides an exciting combination for a wide range of industrial embedded applications where robustness is critical.”   VIA ARMOS-800   The VIA AMOS-800 is specifically designed to support the VIA VAB-800 Pico-ITX board, which features an 800MHz Freescale ARM Cortex-A8 SoC, creating a completely fanless system within a robust chassis measuring 15cm x 4.6cm x 10.8cm (WxDxH). The VIA ARMOS-800 has a certified operating temperature range fr|om -40°C to 80°C and offers ultra-low power consumption of only 3.14W TDP under typical operating conditions. On-board storage includes 4GB of eMMC Flash and can be expanded with the MicroSD Card slot. Front I/O includes one COM, one DIO and one CAN port, as well as Line-in/out and Mic-in, while rear I/O includes, one VGA and one HDMI port, one 10/100 LAN port, and three USB 2.0 ports. An on-board USB pin-header can be utilized to support the optional VNT9271 Wi-Fi USB module.   For more information about the VIA ARMOS-800, please visit:http://www.viaembedded.com/en/products/systems/2030/1/ARMOS-800_(Pico-ITX).html   For images related to this release, please visit:http://www.viagallery.com/Products/via-armos-800.aspx