PR CENTER

PR센터

홈>PR센터>보도자료

보도자료

게시물 상세
[VIA]VIA Announces Distribution Partnership with Italy\'s Top Electronics and Embedded Systems Distr
작성자 : 관리자(jade@goak.co.kr)  작성일 : 2013.05.28   조회수 : 2130
VIA to showcase full range of products in the Jampel booth at Embedded IC & Automation Fortronic 2013

 

Taipei, Taiwan, 22 April, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced that it has signed a distribution agreement with Jampel, the top embedded distributor in Italy. The agreement gives Jampel the ability to promote, distribute, market and sell the full line of VIA Embedded products throughout Italy. VIA will be demoing a full range of products this April 23rd as part of the Jampel booth at Embedded IC & Automation Fortronic 2013, in the Centre Congressi Milanofiori, Milan.

\"Jampel embedded customers are increasingly searching for low power, complete solutions in both x86 and ARM architectures to match the demands of the evolving market,” said Maurizio Di Banella, President of Jampel S.r.l.. “Our partnership with VIA technologies allows us to significantly widen our embedded product and solution offerings, guaranteeing our customers industry leading technology, reliability, quality and support.”

 

Headquartered in Bologna, Italy, Jampel is the leading distributor of passive electronic components and embedded systems across Italy. With over 20 years of experience, Jampel has been driving innovation in transportation and public administration infrastructure with their leading value-add system integration.

 

“VIA has always maintained very high standards when working with distributors. We are happy to say that Jampel easily meets these standards as a world-class embedded systems supplier,” said Epan Wu, Head of VIA Embedded, VIA Technologies, Inc. “With their dynamic approach, technical know-how and strong co-working model with vendors, Jampel is the ideal partner for extending our brand across the Italian market.”

 

For more information about Embedded IC & Automation Fortronic 2013, please visit:
http://www.fortronic.it/page.asp?pag=1282&eveid=293&ln=2

이전글 [VAI]VIA Announces Latest VIA Pico-ITX Board to Jump Start In-Vehicle Innovation, VIA VAB-600
다음글 [VIA]VIA Come-8x80 (with custom carrier board) in GE healthercare