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[공지사항]피닉스컨택트 공식 대리점

2018.07.30

[공지사항]피닉스컨택트 공식 대리점 new

AK정보통신 피닉스컨택트 공식 대리점 협약 완료지난 6월 에이케이정보통신(주)은 피닉스컨택트와 공식적인 업무 협약을 맺고 공식 대리점으로 업무를 시작하였습니다.고객 여러분의 많은 관심 부탁 드리며 자세한 사항은 하기 연락처로 문의 주시면 바로 답변 드리겠습니다.E-mail:sales@goak.co.kr전화번호:02-6093-8888

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[InnoDisk]Innodisk to show full industrial SATA III storage range at Embedded World 2013

2013.04.03

[InnoDisk]Innodisk to show full industrial SATA III storage range at Embedded World 2013

Innodisk to show full industrial SATA III storage range at Embedded World 2013   Taipei, Taiwan - February 21, 2013 – Innodisk, an industry-leading manufacturer and solution provider of industrial embedded flash and DRAM storage products and technologies, will be showing its new range of products for 2013 at the Embedded World 2013 exhibition and conference fr|om 26–28 February in Nuremberg, Germany. Innodisk's complete series of industrial SATA III products includes SSD, SATADOM, SATA Slim, mSATA, and CFast, with a wide variety of form factors and interfaces. With SATA III, Innodisk products can offer sequential read and write speeds two times faster than SATA II, to satisfy almost any embedded systems requirement. Products on display at the Innodisk booth in Nuremberg will also include the Innodisk InnoRobust series of SATA SSDs which are compliant with military standards for ruggedness, durability and reliability in even the most extreme operating environments. Building on its research and development strengths, with the upgrade to SATA III, Innodisk offers support for temperatures ranging fr|om -45°C to 85°C, customized firmware for specific system applications ranging fr|om entertainment to aerospace, power outage data protection and other advanced functions, moving the industrial PC application market forward into the next generation. As well as almost doubling read and write speeds, the upgraded SATA III 2.5-inch SSDs provide a lower power design with enhanced power saving sleep modes. New products are expected to be on the market in March 2013. Innodisk turns a product into a true solution with the exclusive iSMART disk health monitoring tool to protect customer's investments in SSDs and HDDs. Powerful and easy-to-use, iSMART does not just display passive information and a disk lifespan prediction, but can also save hours of setup and maintenance time by giving users easy one button access to write-protection, ATA Security, quick erase, and power saving features. Innodisk will also be introducing advanced LR-DIMM memory modules for capacities up to 64GB. With Innodisk 64GB 1333MHz LR-DIMM, servers can break through existing memory capacity constraints for improved performance, greater reliability, and lower operating costs. Finally meeting the demanding requirements of the latest cloud computing applications, these exciting new products are expected to be on the market in the second quarter of 2013. As well as these new products, Innodisk will be showing other popular products and recent innovations fr|om its existing range. These devices feature iSLC technology that greatly extends the lifetime of NAND flash with similar performance of SLC-based flash, but at a significantly lower cost. There will also be DRAM products with support for the ARM architecture, 32 bit modules, rugged mounting pads, and module height of 17.9mm for small form factor systems. With a very wide range of popular products and new innovations to offer, Innodisk welcomes your questions, advice and comments, and looks forward to meeting friends fr|om the industry, as well as potential new customers, at Embedded World 2013.

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[VIA]VIA Showcases VIA Vantage Digital Signage Solutions @ DSE 2013

2013.04.03

[VIA]VIA Showcases VIA Vantage Digital Signage Solutions @ DSE 2013

VIA Showcases VIA Vantage Digital Signage Solutions @ DSE 2013   Signage solutions fr|om A to Z including multiscreen video walls and interactive touch displays to turnkey x86 and ARM based solutions Taipei, Taiwan, 21 February, 2013 - VIA Technologies, Inc. today announced it will be showcasing the full range of VIA Vantage digital signage solutions at Digital Signage Expo (DSE) 2013, in the Las Vegas Convention Center, booth #1248, this February 27-28. Ranging fr|om a massive 16-screen video wall to ultra-compact interactive touch display systems, the VIA Vantage line provides customers with an unrivaled choice of customizable systems ideal for a broad spectrum of environments. Also on display will be solutions integrating Capital Networks Audience software for both Windows and Android platforms as well as a dynamic multiscreen menu board enabled through our partnership with Popstar Networks.   “This past year has seen an amazing growth in the DOOH market as consumer expectations have come to demand heightened engagement in traditional brick & mortar and an ever increasing number of public spaces,” said Epan Wu, Head of VIA Embedded, VIA Technologies, Inc. “Customers can partner with us fr|om A to Z in the creation of customized VIA Vantage solutions which reimagine how screens can be utilized to draw in and engage their audience.”   For more information about VIA Vantage digital signage solutions, please visit:http://www.viaembedded.com/en/solutions/DigitalSignage.jsp   For more information about DSE 2013, please visit:http://www.digitalsignageexpo.net/

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VIA An-nounces First Android BSP Enabling Split-Screen Multi-Touch Digital Signage Display

2013.04.03

VIA An-nounces First Android BSP Enabling Split-Screen Multi-Touch Digital Signage Display

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[VIA]VIA Showcases Eye-Catching 16-Screen VIA Vantage Digital Wall at DSE 2013

2013.04.03

[VIA]VIA Showcases Eye-Catching 16-Screen VIA Vantage Digital Wall at DSE 2013

VIA Showcases Eye-Catching 16-Screen VIA Vantage Digital Wall at DSE 2013   VIA Showcases Eye-Catching 16-Screen VIA Vantage Digital Wall at DSE 2013   Unrestricted stitching feature for innovative mosaic displays in resolutions of up to 4K ultra-HD   Taipei, Taiwan, 28 February, 2013 - VIA Technologies, Inc. will be showcasing a massive VIA Vantage Digital Wall composed of sixteen 46” super slim displays at the Digital Signage Expo (DSE) 2013, in the Las Vegas Convention Center, booth #1248, this February 27-28. The VIA Vantage Digital Wall is a fully customizable solution with the use of either high-definition LCD displays or LED panels to better match the needs of any indoor or outdoor space and supports resolutions of up to 4K ultra-HD for rich life-like images, videos, animations, and other artistic effects. Incorporating an unrestricted stitching feature, customers can freely combine panels in innovative new patterns to create mosaic-like displays which can run up to six independent 1080p videos simultaneously in the most popular formats including H.264, MPEG2, MPEG4, VC1, WMV9, WMV, AVI, MKV, ASF, FLV and DVR-MS. A user-friendly drag and drop interface with unique big screen stitching capabilities makes content management and scheduling a breeze. With this flexibility customers are free to arrange content across multiple screens to deliver the maximum impact in a diverse range of environments such as airports, bus and train stations, hotels, museums, offices, shopping centers, movie theaters and a host of other public spaces. “Many customers are increasingly looking for innovative ways to incorporate digital signage into the fabric of traditional spaces to create engaging new experiences for consumers,” said Epan WU, Head of VIA Embedded, VIA Technologies, Inc. “In Taiwan the widespread adoption of the VIA Vantage Digital Wall has already begun to reshape the market landscape and we believe that it has huge potential for exciting new deployments throughout the rest of the world.”   For more information about VIA Vantage Digital Signage solutions, please visit:http://www.viaembedded.com/en/solutions/DigitalSignage.jsp   For images related to this press release, please visit:http://www.viagallery.com/Products/via-vantage-digital-wall.aspx

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[VIA]VIA Embedded Launches Smallest Ever Embedded System - ARMTiGO A800 on January 24

2013.01.25

[VIA]VIA Embedded Launches Smallest Ever Embedded System - ARMTiGO A800 on January 24

    VIA ARMTiGO A800 Fanless and low profile design (only 3cm high) Powered by Freescale Cortex-A8 single core i.MX537 with Pico-ITX board 4GB onboard eMMC Flash memory Supports 1GB x DDR3-800 SDRAM memory size Standard temperature support fr|om 0°C to 50°C Supports Android and Linux Ubuntu Supports HDMI, VGA, LAN, 4 USB 2.0, 1 Micro SD slot and wireless module (optional) >> ARMTiGO A800 Product Website >> ARMTiGO A800 Datasheet (PDF) >> ARMTiGO A800 Image Kit  

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[InnoDisk]InnoDisk iSLC Series Offers New Cost-effective Option for Solid State Drives

2013.01.22

[InnoDisk]InnoDisk iSLC Series Offers New Cost-effective Option for Solid State Drives

InnoDisk iSLC Series Offers New Cost-effective Option for Solid State Drives   (TAIPEI, Taiwan - November 19, 2012) - InnoDisk, a worldwide leading manufacturer of industrial data storage solutions, is proud to announce a series of flash products with a new and exclusive technology-- iSLC [2IE series], designed to outdo the endurance, performance and reliability of MLC-based solutions. Through the use of flash management algorithms, iSLC improves SSD endurance up to 30,000 times, increasing lifespans to at least 10 times longer than MLC-based solutions. In addition, iSLC improves the performance of solid state drives, with similar write performance of SLC-based solutions, and with data quality that is on par with SLC technologies. The InnoDisk iSLC series is extremely cost efficient, boasting excellent benefits at only half the price of SLC-based solutions. For many years, the flash industry has known SLC NAND flash to be more reliable and maintain longer endurance than MLC, and was in turn accepted it as the best choice for industrial and enterprise applications, albeit at the expense of increased costs. While MLC flash has become attractive in recent years as a cost-saving alternative to SLC, both the endurance and performance will almost certainly decrease in the near future. To compensate for flash technology node progression (fr|om 4xnm to 2xnm), flash manufacturers would need to specify more error correction code (ECC) to achieve a higher endurance. According to recent testing data, 5xnm MLC requires ECC capabilities to be 8 bits, while 2xnm MLC requires that ECC capabilities be increased to 24 bits. InnoDisk is disrupting the industry, providing an answer amid economic concerns, with new iSLC technology, the 2IE product series. Delivering greater endurance, and nearly SLC performance According to our testing results, 2IE products with iSLC can estimate to sustain 32GB capacity drive writes per day for 7.6 years, outdoing the MLC drive at least 10 times. InnoDisk prides itself in the ability to customize our products to your needs. We´ve developed the 2IE series with different form factors, including 2.5" SATA SSD, mSATA, SATASlim and CFast. For example, the capacity of the SATA SSD 2.5" 2IE ranges fr|om 16GB to 256GB, supports SATA II interface, and has sequential read and write speeds of up to 240/220 MB/sec with 8 channels. This is comparable with the SLC performance of similar products (for reference, SLC sequential read and write speeds are up to 250/230 MB/sec with 8 channels). With a variety of form factors, customized firmware solutions, and innovative R&D capabilities, InnoDisk is the best solution for all of your industrial storage needs.

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[InnoDisk]Innodisk Announces Rebranding and New Corporate Visual Identity

2013.01.22

[InnoDisk]Innodisk Announces Rebranding and New Corporate Visual Identity

Innodisk Announces Rebranding and New Corporate Visual Identity   Taipei, Taiwan - January 2, 2013 - Innodisk has officially announced the completion of a recent corporate-wide rebranding program. This rebrand, which includes the launch of Innodisk’s new visual identity and new corporate communications, marks a significant transformation of the Innodisk brand, reflecting the company’s drive to become a service-driven global leader in the industrial embedded memory industry. Innodisk’s new corporate identity system features a redesigned logo, with the Innodisk name now written in lower case and framed in red. This new logo represents Innodisk’s dedication to delivering the best service in an industry where service is what customers demand most. The new logo also uses a single color theme to reinforce the company’s focus on doing one thing at a time, and doing it well. In addition, the vibrant red color of the logo symbolizes Innodisk’s enthusiasm for service while the lower case font represents the company’s friendly, approachable spirit. And a small red block on the upper right side of the logo stands for Innodisk’s promise to its partners to continually improve while continuing to do more for them. All in all, the new logo reflects the true spirit of Innodisk—passionate, yet humble, and always thinking ahead when helping customers. Richard Lee, the chairman of Innodisk, commented, “Through this rebranding process, we’ve redoubled our efforts to provide exemplary service to our customers and business partners.” He continued, “We believe that helping our clients achieve success is worth the time and effort.” Lee concluded, “fr|om the beginning, Innodisk has dedicated itself to becoming a world-class flash storage and DRAM module company that focuses on helping our customers and partners to be successful and make a profit. This rebranding process has solidified our commitment to a service-oriented business model, and we have stayed true to our vision.” Throughout the company’s history, Innodisk has consistently evolved and expanded, reengineering its own internal processes to ensure that it remains at the forefront of the industry. In the past 5 years in particular, Innodisk’s operations have seen tremendous growth. During this time, Innodisk has extended its product offerings through acquisitions, including the recent integration of Actica’s server storage products. It has also expanded production lines and increased investment in quality-testing machinery. The decision to rebrand was very much strategic for Innodisk, as it comes hand-in-hand with the company’s preparations for an IPO launch in late 2013. The rebranding process has helped to prepare each of Innodisk’s departments for the company’s continued growth, which is being fueled by the company’s service-oriented approach. In particular, Innodisk has launched an Absolute Service campaign to reinforce the company’s dedication to its customers. As part of its commitment to Absolute Service, Innodisk has upgraded its internal operations, making it even easier for customers and business partners to contact the Innodisk team and access crucial information.

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[VIA]VIA Enables Medical OEMs to Take Advantage of Exciting Growth Opportunities in Medical Market

2013.01.22

[VIA]VIA Enables Medical OEMs to Take Advantage of Exciting Growth Opportunities in Medical Market

  VIA Enables Medical OEMs to Take Advantage of Exciting Growth Opportunities in Medical Market   Combines widest range of x86 and ARM platforms with unrivaled longevity and exceptional software development support Taipei, Taiwan, 20th December, 2012 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced tit enables medical OEMs to take advantage of the exciting growth opportunities in the medical market by offering the widest selection of low-power x86 and ARM based solutions on the market. VIA provides fully customizable application ready platforms together with extended software and firmware services which medical OEMs can leverage for a wide range of medical usage models and applications including ultrasound, diagnostics, POC (Point of Care) terminals, patient monitoring, therapeutic, as well as exercise and fitness equipment. With a long history as a full-service medical OEM solutions provider to many of the top industry players, VIA provides a robust medical roadmap which includes a full range of COM Express, ETX and QSeven system on modules, embedded mainboards in Mini-ITX and Pico-ITX form factors, and embedded systems based on VIA AMOS and VIA ARTiGO designs, as well as a full line of medical-grade touch displays with the VIA ALMA-3000 series. VIA also offers unparalleled longevity support for increased lifecycle management, support for a wide range of software and board operating systems and support for critical medical standards including UL-60601, EN-60601 and medical QMS (Quality Management System) ISO-13485. This enables customers to deliver products with unique feature-set advantages and a faster time-to-market.   “Medical OEMs are faced with many challenges, including compliance with rigid safety standards, in creating products with additional features and differentiators for the market,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “Through partnering with VIA, our OEM customers can leverage our experience, expertise and resources to create sustainable competitive advantages within the rapidly growing medical market.” VIA Medical Solutions As a full service medical OEM solutions provider, VIA uniquely offers the widest selection of low-power x86 and ARM based solutions at the board, module, system and platform level, together with a comprehensive line of medical specific I/Os and technologies. With a flexible business model, manufacturing excellence and compliance with high quality and environmental standards, OEM customers can leverage the experience, expertise and resources of VIA to focus on their value-adds and create key differentiators.   VIA System on Modules   VIA ETX Module VIA COM Express Module in Compact, Mini and Basic Form Factor VIA QSeven Module   VIA Embedded Mainboards   VIA Mini-ITX VIA Pico-ITX VIA ARM-based VAB Series   VIA Embedded Systems   VIA ARTiGO Series VIA AMOS Fanless Series   VIA Medical-Grade Touch Displays   VIA ALMA-3000 Series   For more information about VIA Medical solutions and services please visit:http://www.viaembedded.com/en/solutions/Healthcare-and-Medical-Computing-Solutions.jsp

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[VIA]VIA Announces Ultra Compact VIA ARMOS-800, First ARM Based Industrial System

2013.01.22

[VIA]VIA Announces Ultra Compact VIA ARMOS-800, First ARM Based Industrial System

VIA Announces Ultra Compact VIA ARMOS-800, First ARM Based Industrial System   Delivers extreme power efficiency in a ruggedized chassis system for a diversified range of embedded applications   Taipei, Taiwan, 15 January, 2013 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARMOS-800, an ultra-compact, fanless system designed around the tiny VIA VAB-800 Pico-ITX board. The VIA ARMOS-800 provides embedded customers with a ruggedized system that delivers advanced multimedia features in an extremely power efficient design for a diversified range of embedded applications. Featuring an 800MHz Freescale ARM Cortex-A8 SoC with two integrated GPUs for dual display support, the VIA ARMOS-800 is optimized for both performance and power to meet the high-end demands of advanced industrial and in-vehicle applications. Boasting a ruggedized, fanless system design with a wide operating temperature range fr|om -40°C to 80°C , the VIA ARMOS-800 delivers a typical power consumption of a mere 3.14W TDP. "The VIA ARMOS-800 is the first ARM-based system in our ruggedized AMOS systems series," said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. "The high performance and ultra-low power consumption provides an exciting combination for a wide range of industrial embedded applications where robustness is critical.”   VIA ARMOS-800   The VIA AMOS-800 is specifically designed to support the VIA VAB-800 Pico-ITX board, which features an 800MHz Freescale ARM Cortex-A8 SoC, creating a completely fanless system within a robust chassis measuring 15cm x 4.6cm x 10.8cm (WxDxH). The VIA ARMOS-800 has a certified operating temperature range fr|om -40°C to 80°C and offers ultra-low power consumption of only 3.14W TDP under typical operating conditions. On-board storage includes 4GB of eMMC Flash and can be expanded with the MicroSD Card slot. Front I/O includes one COM, one DIO and one CAN port, as well as Line-in/out and Mic-in, while rear I/O includes, one VGA and one HDMI port, one 10/100 LAN port, and three USB 2.0 ports. An on-board USB pin-header can be utilized to support the optional VNT9271 Wi-Fi USB module.   For more information about the VIA ARMOS-800, please visit:http://www.viaembedded.com/en/products/systems/2030/1/ARMOS-800_(Pico-ITX).html   For images related to this release, please visit:http://www.viagallery.com/Products/via-armos-800.aspx

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[VIA]ARM-based Embedded System ARMOS-800 on Jan 15

2013.01.14

[VIA]ARM-based Embedded System ARMOS-800 on Jan 15

  VIA ARMOS-800 Fanless, rugged and ultra compact design (Same chassis structure with AMOS-3001) Powered by Freescale Cortex-A8 single core i.MX537 with Pico-ITX board 4GB onboard eMMC Flash memory Support 1GB x DDR3-800 SDRAM memory size Optional Wireless module support Support HDMI, VGA, LAN, 1 COM, 3 USB 2.0, 1 CANBus, 1 GPIO, 1 Micro SD card slot >> VAB-800 Product Website >> Datasheet >> ARMOS-800 Image Kit   Inside:VAB-800 Embedded Board • The first VIA ARM Pico-ITX board, ideal for a broad range of in-vehicle and industrial applications • Flawless HD video performance up to 1080p • Board support packages (BSP) for the Android and Linux    

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[VIA]Healthcare and Medical Computing

2013.01.04

[VIA]Healthcare and Medical Computing

Healthcare and Medical Computing Today's medical OEMs are faced with many challenges, ranging fr|om compliance to safety standards, reduction of recurring costs for their products to creating products with additional features and differentiators. Additional challenges such as dramatic increase in compliance and regulatory requirements in both hardware and software are also raising the importance of getting the right medical solutions with good quality. VIA has a long history as a full-service medical OEM solutions provider, offering quality products and solutions that are innovative, reliable, and with guaranteed longevity. These solutions include application ready platforms, customizable to fully customized products, together with extended software and firmware services. Combining our innovative technology, medical know-how and our ability to support critical medical standards (UL-60601 and EN-60601) and medical QMS (Quality Management System) ISO-13485, VIA is strongly positioned to support medical OEMs for a diverse range of applications. These usage models and applications include ultrasound, diagnostics, POC (Point of Care) terminals, patient monitoring, therapeutic, as well as exercise and fitness equipment. As a full service medical OEM solutions provider, VIA uniquely offers the widest selection of low-power x86 and ARM based solutions at the board, module, system and platform level, together with a comprehensive line of medical specific I/Os and technologies. Our flexible business model, manufacturing excellence and compliance with high quality and environmental standards, allows our OEM customers to leverage our experience, expertise and resources, leaving them to focus on their value-adds and creating key differentiators. Whether you are creating a patient diagnostic instrument, a therapeutic device, or a portable imaging device, VIA is the perfect choice for assisting you to deliver products fast time to the market and unique feature-set advantages over your competition. Digital Hospital Solutions | Interactive eHealthcare Solutions Robust Roadmap in Various Form FactorsVIA offers a great breadth of product choice in x86, ARM and discrete GPU technologies for mainboards, modules and systems supporting single or multi-core processors to enhance scalability in performance and size for medical and healthcare solutions. In addition, application-ready platforms such as POC (Point-of-Care) terminals or MCA (Medical Clinical Assistance) are also provided to enable medical OEMs to meet changing market requirements and reduce time and cost to market. Direct and Responsive Technical Support in Hardware, Software and FirmwareVIA provides complete turnkey solutions to help customers avoid compatibility concerns with various components and strong backup and technical support in the silicon level. Our technical teams and service centers in Germany, US, Taiwan and China provide timely support to reduce turnaround time. Software and Broad Operating Systems SupportVIA supports operating systems including Windows Embedded Compact 7.0, Linux, RTOS (VxWorks), Android and even legacy Windows CE 5.0. Our customers can get BSP (board support package) for the basic configuration of the embedded operating system in a particular platform or add several features into a standard BSP bundle to meet their medical and healthcare requirements. More Than 7 Years Longevity and Lifecycle Management SupportVIA has true organic expertise at any level by providing our own silicon, boards, modules and systems with extensive know-how capabilities in medical and healthcare applications. VIA understands how product stability, reliability and durability influence decisions on cost maintenance and later upgrades. To ensure quality and availability of components used in projects, our boards and systems are available with more than 7 years longevity and frozen BOM for long-term projects to control and improve overall cost efficiency. Customized Design Meet Critical Medical Standards and CertificationsExcellent product quality is at the core of VIA’s commitment to our customers, especially for highly sophisticated medical and healthcare applications. VIA strives to be the best partner possible with our customers by supporting such standards as UL60601 and EN60601 for medical equipment safety and we work with ISO 13485 manufacturer certificated factories for quality management of medical devices to ensure our design and manufacturing are certified under current regulations.

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[VIA]VIA EPIA-P910 stuffs 3D display support, quad-core into a Pico-ITX size

2012.11.06

[VIA]VIA EPIA-P910 stuffs 3D display support, quad-core into a Pico-ITX size

  If there's been a race in the Pico-ITX realm to catch up to full-size PCs, VIA just leapt ahead by a few bounds with the EPIA-P910. The tiny PC mates one of VIA's 1GHz QuadCore E-Series processors with a VX11H media core to handle the kinds of tasks that would break just about any other system its size: stereoscopic 3D displays and DirectX 11 3D graphics are entirely within the realm of possibility. Likewise, there's a surprising amount of expansion headroom compared to many of the P910's similarly small counterparts, such as the 8GB RAM ceiling and support for both HDMI 1.4a and USB 3.0. You'll need to get in touch with VIA if you want to find out how much it costs to work the new EPIA into an embedded PC, and it's more likely to be headed to corporate buyers than to homebrew projects. We're still looking forward to the shot of visual adrenaline, whether it's in a mini PC or a store display.

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[VIA]World's Smallest x86 Quad Core System, VIA ARTiGO A1250

2012.11.06

[VIA]World's Smallest x86 Quad Core System, VIA ARTiGO A1250

Features USB 3.0, stereoscopic 3D and HD video support, for an immersive multimedia experience   Taipei, Taiwan, 31st October, 2012 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the world's smallest x86 quad core system, the VIA ARTiGO A1250 slim system, featuring a 1.0GHz VIA QuadCore processor and the latest VIA VX11H media system processor (MSP), in chassis the size of a paperback novel. The ultra-compact VIA ARTiGO A1250, is suitable for a myriad of applications in the home or office, including home server, home automation, hotel management, media streaming, digital signage and surveillance as well as medical and healthcare applications. The VIA ARTiGO A1250 leverages the VIA VX11H MSP to deliver an immersive multimedia experience complete with 3D stereoscopic and HD display support in a low power envelope, which a typical power consumption of a mere 32W TDP. The VIA ARTiGO A1200 can fit easily into any environment, whether it is behind a monitor or on the wall with a 10 x 10 cm VESA mount or placed alongside other home media devices. For system developers, VIA provides third party software security through a unique hardware/software design. “By leveraging the ultra compact Pico-ITX form factor, the VIA ARTiGO A1250 is able to deliver a powerful x86 quad core computing experience in the smallest system design on the market,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA ARTiGO A1250 boasts the latest technology with 3D stereoscopic display and USB 3.0 support for an unparalleled ultra compact computing experience, making small truly beautiful.”   VIA ARTiGO A1250   The VIA ARTiGO A1250 is the slimmest full featured quad core system on the market today with an ultra low-profile design measuring a mere 17.7cm x 12.5cm x 3.0cm (W X D X H), a full ten percent smaller than the VIA ARTiGO A1150 series. A power efficient 1.0GHz VIA QuadCore E-Series processor is combined with the latest highly integrated all-in-one VIA VX11H MSP which features the integrated VIA Chromotion 5.0 video processor with DX11 support for richer textures and 3D stereoscopic display. The VIA ARTiGO A1250 delivers an exceptional multimedia experience with advanced filtering and cutting edge post-processing to perform ultra smooth decoding of H.264, MPEG-2, VC-1, and WMV9 for smooth playback of the most demanding multimedia titles at resolutions up to 1080p without incurring a heavy CPU load. The unique dual-sided I/O coastline interface includes one HDMI and one VGA display port, one GigaLAN Ethernet port, two USB 3.0 and two USB 2.0 ports, audio jacks (Line-in/out and mic-in) and 12V DC-in power.   For more information about the VIA ARTiGO A1250 please visit:http://www.viaembedded.com/en/products/systems/1990/1/ARTiGO_A1250_(Pico-ITX).html   For images related to this release please visit:http://www.viagallery.com/Products/via-artigo-a1250.aspx   To watch an introduction to the ARTiGO A1250 please visit:http://youtu.be/7msvgL3LgsY  

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[VIA]VIA Embedded Lauches ARTiGO A1250 on October 31

2012.11.01

[VIA]VIA Embedded Lauches ARTiGO A1250 on October 31

      Product Web Site Datasheet (PDF) Image Kit   Features: 1.0GHz VIA QuadCore E processor Supports DirectX 11 3D/2D graphics with MPEG2, MPEG4, WMV9/VC1, H.264 decoding acceleration Up to 8GB of DDR3 1333 SDRAM SODIMM USB 3.0 x 2, USB 2.0 x 2, SATA, Flash SSD GigaLAN, HDMI, VGA Supports DC jack strap holder to prevent power cord fr|om accidently falling off Support customized security schemes to protect certain software fr|om being replicated     Applications: Digital Signage Digital media application Gaming Healthcare   VIA VX11H Media System Processor Best for interactive application DX11 Graphics & Open GL3.2 support Integrated USB 3.0 & COM*4 DDR3 1333 MHz support BD & Full HD support  

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[VIA]세계 최저 저전력 쿼드코어 X86 프로세서 VIA QuadCore Mini-ITX 임베디드 보드

2012.10.26

[VIA]세계 최저 저전력 쿼드코어 X86 프로세서 VIA QuadCore Mini-ITX 임베디드 보드

최대 8GB DDR3 시스템메모리지원 온보드 HDMI와 VGA 포트, 2개의 18/24-bit LVDS 듀얼 Gigabit Ethernet 지원 8개의 COM 포트 8개의 USB 2.0 포트 ATX 또는 DC-in 파워서플라이지원 Product Web Site Datasheet   최대 8GB DDR3 지원 VC1, H.264, WMV9 HD 비디오를위한하드웨어액셀러레이션 온보드 HDM, VGA 포트, 듀얼채널 24 비트 LVDS 4개의 COM 포트 8개의 USB 2.0 포트 HD DVD와 Blu-ray 오디오콘텐츠보호 Product Web Site Datasheet   VIA QuadCore E-Series Processor • 뛰어난에너지효율성아키텍쳐 • 고성능슈퍼스칼라프로세싱 • Out-of-order x86 아키텍쳐 • 효율적인 floating point unit (2 clock SP multiplies) • 고급형멀티코어프로세싱 • 64-bit OS를위한 Native 지원 • 하드웨어가상화지원 • 고급형전력, 온도관리 • AES 하드웨어보안기능 • 안전한해쉬알고리즘: SHA-1, SHA-256, SHA-384, SHA-512 • VIA 프로세서와 pin-to-pin 호환

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[InnoDisk]InnoDisk Pioneers World´s Smallest Nano USB Drive for Industrial Applications

2012.10.24

[InnoDisk]InnoDisk Pioneers World´s Smallest Nano USB Drive for Industrial Applications

Date: 10/17/2012 (TAIPEI, Taiwan - October, 17 2012) - InnoDisk, a worldwide leading manufacturer of industrial data storage solutions, recently pioneered the smallest industrial USB storage in the world, appropriately named Nano USB. With an unparalleled size of only 19.4x15.4x6.9mm (WxLxH), the new Nano USB requires just one third the space of its original industrial USB counterpart, making it small enough to avoid any interference with other motherboard components and ensure better case ventilation. When inserted into a USB slot, only 25 percent of the Nano USB device-a mere 5 mm?remains exposed on the motherboard. As electronic devices and peripherals continue to get smaller, miniaturization is becoming increasingly sought after, especially in the consumer market. For industrial applications, miniaturized embedded components can free up more room for other designs on motherboard and help keep temperatures down. InnoDisk embraces the trend of miniaturization and has been researching and developing a variety of miniaturized embedded components and making leaps and bounds in terms of technological advancements. However, the Nano USB´s small form factor is just one of its many advantages. A special hardening process is used to manufacture the Nano USB´s gold finger to deliver higher quality data transmission and greater durability than regular USB devices. To fulfill the industry´s needs, Nano USB is embedded with SLC NAND flash. Moreover, it features enhanced power cycling which ensures data integrity in flash when abnormal power failure happens. (up to 1,000 times). InnoDisk Nano USB offers several key features which make it more reliable, such as being ESD resistant to 8KV (contact discharge) and 15KV (air discharge). At the same time, it also features a wide operating temperature range fr|om -40o to 85oC, making it well-suited for industrial control applications in a variety of different working conditions. InnoDisk Nano USB is available in capacities fr|om 1GB to 8GB in order to meet the needs of our customers and provide flexible options. Nano USB can be used for a variety of different tasks, including as an OS boot drive, security key, and for data buffering. Customized VID and PID are also available for the OEM market. For more information on InnoDisk´s product line, range of services, technologies, and applications, please visit www.innodisk.com.

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[VIA] VIA Embedded Partner Zone Newswire – Issue: August, 2012

2012.08.06

[VIA] VIA Embedded Partner Zone Newswire – Issue: August, 2012

    VIA Announces First Embedded ARM Based Pico-ITX Board, VIA VAB-800VIA announced the VIA VAB-800 Pico-ITX embedded ARM board. Featuring a choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor, the VIA VAB-800 combines a wide operating temperature range with extremely low power consumption to meet the demands of high-end industrial and in-vehicle fanless embedded applications. VIA makes its first ARM-based Pico-ITX board, adds dual graphics for your in-car pleasureengadget.com | Jon Fingas | Jul 25 2012VIA has only ever really had a dalliance with ARM; the VAB-800 might be a sign that it's willing to go steady for awhile. As the company's first Pico-ITX board with an ARM chip, the 800 stuffs up to a 1GHz, Freescale-made ARM Cortex-A8 and 1GB of RAM into a tiny, 3.9 x 2.8-inch board. Somehow, it still fits up to four USB 2.0 ports, mini HDMI, VGA and as much as 64GB of storage.   VIA ARM Digital Signage System: A New Small Android-based PCThe Droid Guy | Glenn | June 28, 2012It is powered by an ARM CPU as its name implies. Specifically, it is equipped with an industry standard Cortex A9 processor and sports 64 GB of internal storage alongside 2 GB of DDR2 RAM. Likewise, it has 4 USB 2.0 ports and an HDMI port for connecting the device to peripherals or a larger display like a monitor or an HD television.   Embedded IC & Automation Fortronic 2012 - Interview with Titian Albani, VIA Technologies (Italian)Titian Albani, European Business Development Director at VIA Technologies, talks about the company and the solutions presented at ' Embedded IC & Automation Fortronic 2012 (Milan, June 21, 2012) - an event sponsored by Assodel (National Association of Electronics Suppliers) and the Group Embedded & IC, dedicated to the world of 'embedded system'. www.Fortronic.it

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[VIA] VIA Announces First Embedded ARM Based Pico-ITX Board, VIA VAB-800 (ARM 기반 Pico-ITX 보드, VIA V

2012.08.01

[VIA] VIA Announces First Embedded ARM Based Pico-ITX Board, VIA VAB-800 (ARM 기반 Pico-ITX 보드, VIA V

Ultra low power ruggedized design ideal for a broad range of industrial and in-vehicle applications Taipei, Taiwan, 24th July, 2012 - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-800 Pico-ITX embedded ARM board. Featuring a choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor, the VIA VAB-800 combines a wide operating temperature range with extremely low power consumption to meet the demands of high-end industrial and in-vehicle fanless embedded applications. Based on the industry standard 10 cm x 7.2 cm Pico-ITX form factor created by VIA, the VIA VAB-800 Pico-ITX board combines a rich I/O set with superb multimedia performance, supporting playback of the most demanding video formats in resolutions up to 1080p. Leveraging VIA’s hardware design expertise, the VIA VAB-800 delivers the highest I/O integration on the Pico-ITX form factor for an ultra compact yet highly flexible platform for the latest embedded devices.   The extremely ruggedized VIA VAB-800 Pico-ITX supports a wide operating temperature range fr|om -20 to 70 degrees Celsius in an ultra low TDP envelope of only 5W and is backed with a minimum seven years longevity support.   Customers can take advantage of VIA’s worldwide embedded software development expertise to quickly create customized designs for a fast time to market approach and is available as a hardware starter kit with board support packages (BSPs) for the Android, Ubuntu and Windows Embedded Compact 7 operating systems.   “The VIA VAB-800 extends our industry leading range of Pico-ITX embedded platforms,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “As a leader in hardware and software support, VIA can tailor our new ARM based offerings for customers to create systems through starter kits, customization support or offering complete systems for different applications.”   VIA VAB-800 Pico-ITX Based on the ultra compact Pico-ITX form factor, measuring 10 cm x 7.2 cm, the VIA VAB-800 combines the choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor with two independent, fully integrated GPUs for a power efficient platform with a max TDP of a mere 5W. The two integrated GPUs provide support for dual independent displays along with 3D/2D graphics acceleration to deliver full HD playback support for the most demanding video formats in resolutions up to 1080p.   Rear I/O includes one Mini HDMI and one VGA display port, two USB ports and one 10/100 Ethernet port. On-board features include up to 64GB eMMC Flash memory, 1GB DDR3 SDRAM, support for one SATA port, two single channel LVDS display ports, two COM ports, CAN Bus, front pin headers for line-in/out and MIC-in, a further two USB 2.0 ports, an SDIO pin header and eight GPIOs.   For more information about the VIA VAB-800 Pico-ITX, please visit: http://www.viaembedded.com/en/products/boards/1930/1/VAB-800.html   For images related to this release, please visit:http://www.viagallery.com/Products/via-vab-800-pico-itx-board.aspx     Availability Sample units of the VIA VAB-800 Pico-ITX board are available at the time of this release   Taipei, Taiwan, 2012년 7월 24일 - 혁신적인 저전력 컴퓨팅 플랫폼 전문 기업 VIA Technologies, Inc,에서 VIA VAB-800 Pico-ITX 보드를 출시한다고 발표했습니다. 800MHz 또는 1GHz Freescale ARM Cortex-A8 프로세서 사양으로 출시된 VIA VAB-800은 저전력 소비와 광범위한 가용 온도 범위로 하이앤드 산업용이나 차량용 팬리스 임베디드 어플리케이션에 이상적으로 적용할 수 있습니다. VIA VAB-800은 두 개의 통합 GPU으로 듀얼 독립 디스플레이를 지원하며 3D/2D 그래픽 액셀러레이션으로 최신 그래픽 포맷을 최대 해상도 1080p, full HD로 재생합니다.   고객들은 VIA의 전세계 소프트웨어 전문 지식을 활용하여 최단 시간에 고객화된 제품을 디자인하여 시장에 진입하거나 Android, Ubuntu, Windows Embedded Compact 7 OS를 위한 board support packages (BSPs)와 스타터 키트를 이용해 고객화된 시스템을 설계할 수 있습니다.   “성능과 전력을 위해 최적화된 다양한 용도의 VIA VAB-800은 오늘날 다양하게 변화하고 있는 임베디드 시장의 니즈를 만족시킵니다. 하드웨어와 소프트웨어 선두 기업인 VIA는 스타터 키트, 고객화 지원, 다양한 어플리케이션을 위한 완벽한 시스템 지원으로 고객들이 원하는 다양한 지원을 하고 있습니다.”라고 VIA 임베디드 플랫폼 사업부장, Epan Wu가 인터뷰했습니다.   VIA VAB-800 Pico-ITX 사이즈 10 cm x 7.2 cm의 울트라 초소형 Pico-ITX 폼팩터 기반의 VIA VAB-800은 800MHz 또는 1GHz Freescale ARM Cortex-A8 프로세서 사양으로 두 개의 독립적이며 뛰어난 전력 효율 플랫폼을 위해 완벽히 통합된 GPU를 최대 TDP 5W으로 지원합니다. 아주 견고한 설계의 VIA VAB-800은 가용 온도 -20 ~ 70도로 제품 지원은 7년까지 보장됩니다.   후면 I/O에는 Mini HDMI, VGA 디스플레이 포트, 2개의 USB 포트, 10/100 Ethernet 포트가 있습니다. 온보드 기능에는 최대 64GB eMMC Flash memory, 1GB DDR3 SDRAM, SATA 포트, 2개의 싱글 채널 LVDS 디스플레이 포트, 2개의 COM 포트, CAN Bus, line-in/out을 위한 핀헤더와 MIC-in, 추가 2개의 USB 2.0 포트, SDIO 핀헤더와 8개의 GPIOs가 있습니다.   VIA VAB-800 Pico-ITX에 대한 보다 자세한 정보는 다음 링크를 참고하세요.http://www.viaembedded.kr/kr/products/boards/1930/1/VAB-800.html   관련 이미지는 다음 링크를 참고하세요.http://www.viagallery.com/Products/via-vab-800-pico-itx-board.aspx     구매 VIA VAB-800 Pico-ITX 샘플이 출시되어 있습니다.

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[VIA]VIA Embedded Launches the First ARM-Based Pico-ITX Embedded Board on July 24

2012.07.27

[VIA]VIA Embedded Launches the First ARM-Based Pico-ITX Embedded Board on July 24

  Features Single core Cortex-A8 Freescale i.MX537 800MHz 1GB DDR3 SDRAM memory size Up to 64GB of EMMC Flash 4 USB, 2 COM, 1 mini HDMI, 1 VGA, 2 LVDS Supports Android 2.3, Ubuntu 10.04 and Windows Embedded Compact 7   Benefits VIA offers hardware starter kit and BSP package VIA offers quick turnaround customized design with software development VIA offers application-ready platform for different markets   Downloads VAB-800 Datasheet (PDF) VAB-800 Product Webpage VAB-800 Image Kit   Target Markets   Automotive Applications  The VAB-800 board is designed for applications that require advanced user interfaces, sophisticated video processing, 3D/2D graphics, multiple connectivity options (including CAN) and a high level of system integration. These features enable the VAB-800 board to deliver enhanced device connectivity and user experience for in-vehicle systems.Consumer ApplicationsThe VAB-800 board supports 1080p multi-standard video playback with industry-leading low power consumption. With an 800MHz core speed (with i.MX537), the faster graphics core enables a more responsive user experience, and a higher level of system integration. Industrial ApplicationsThe VAB-800 board provides key environmental differentiators for the industrial market. These include a small compact Pico-ITX form factor and lower manufacturing costs, extended temperature coverage for harsh environments (with i.MX537), industrial qualification for extended reliability and a formal guarantee to support product life spans.   Please contact with VIA regional Sales Representative for more product information about availability,price, and specs. If you…have any queries about the content of this eNewsletterhave trouble accessing the VIA Embedded Partner ZonePlease send an email to embedded@via.com.tw Copyright © 2012 VIA Technologies, Inc. All Rights Reserved.

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[VIA] VIA Announces ARM Digital Signage System with Android Support

2012.07.09

[VIA] VIA Announces ARM Digital Signage System with Android Support

 

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